公开(公告)号：US20180324977A1

公开(公告)日：2018-11-08

申请号：US16040083

申请日：2018-07-19

Applicant: Apple Inc.

Inventor： Eric R. PRATHER ,  Clark E. WATERFALL ,  Reuben J. WILLIAMS ,  Vinh H. DIEP

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/02 ,  F28F1/12 ,  H01L23/467

CPC classification number: H05K7/20154 ,  F28D15/0233 ,  F28F1/12 ,  F28F2250/08 ,  H01L23/427 ,  H01L23/467

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

公开(公告)号：US20170094835A1

公开(公告)日：2017-03-30

申请号：US15199460

申请日：2016-06-30

Applicant: Apple Inc.

Inventor： Eric R. PRATHER ,  Clark E. WATERFALL ,  Reuben J. WILLIAMS ,  Vinh H. DIEP

IPC: H05K7/20 ,  F28F3/02 ,  F28D15/02

CPC classification number: H05K7/20154 ,  F28D15/0233 ,  F28F1/12 ,  F28F2250/08 ,  H01L23/427 ,  H01L23/467

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.