公开(公告)号：US20230282544A1

公开(公告)日：2023-09-07

申请号：US17653633

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Simon J. TRIVETT ,  Brett W. DEGNER ,  Mahesh S. HARDIKAR ,  Michael E. LECLERC ,  Eric R. PRATHER ,  Kevin J. RYAN

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/4093 ,  G06F1/206 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10515

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

公开(公告)号：US20180324977A1

公开(公告)日：2018-11-08

申请号：US16040083

申请日：2018-07-19

Applicant: Apple Inc.

Inventor： Eric R. PRATHER ,  Clark E. WATERFALL ,  Reuben J. WILLIAMS ,  Vinh H. DIEP

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/02 ,  F28F1/12 ,  H01L23/467

CPC classification number: H05K7/20154 ,  F28D15/0233 ,  F28F1/12 ,  F28F2250/08 ,  H01L23/427 ,  H01L23/467

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

公开(公告)号：US20230284372A1

公开(公告)日：2023-09-07

申请号：US17653634

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Kristopher P. LAURENT ,  Brett W. DEGNER ,  Jay S. NIGEN ,  Eric R. PRATHER ,  David H. NARAJOWSKI

IPC: H05K1/02 ,  G06F1/20

CPC classification number: H05K1/0209 ,  G06F1/203 ,  G06F2200/201 ,  H05K2201/064 ,  H05K2201/066

Abstract: This application relates to a layout of components within an electronic device. The electronic device includes a circuit board and one or more thermal components located on or proximate to each surface of the circuit board. As a result, thermal energy generated by components of the circuit board are drawn away from the circuit board in a more efficient manner. Additionally, the electronic device may include one or more air movers designed to draw ambient air into the electronic device in a manner that causes the ambient air to cool components upstream from the air movers. Further, the electronic device includes a fin stack that is thermally coupled to the aforementioned thermal components, and further receives air driven in by the air mover(s). Also, the electronic device is designed to receive the ambient air through openings that define a 360-degree air inlet.

公开(公告)号：US20220287202A1

公开(公告)日：2022-09-08

申请号：US17448700

申请日：2021-09-23

Applicant: Apple Inc.

Inventor： Anthony Joseph AIELLO ,  Brett W. DEGNER ,  Jesse T. DYBENKO ,  Arash NAGHIB LAHOUTI ,  Eric R. PRATHER

IPC: H05K7/20 ,  F04D17/16 ,  F04D29/30 ,  F04D29/28

Abstract: Fan assemblies are disclosed. Fan assemblies include an impeller with asymmetric design. For example, an impeller may include a first set of blades with one geometry and second set of fan blades with another geometry. This enables a dual-inlet centrifugal fan to generate different air flow performance characteristics for the air entering one fan inlet compared to the air entering the other fan inlet. The impeller, with different fan blade configurations, can better handle air flow entering the fan assembly through different inlets, particularly when the air flow conditions differ through the inlets due to impeding structures (e.g., motor, struts, etc.). As a result, air flow distribution from air leaving the impeller, including the locations associated with the different fan blade configurations, is relatively uniform. Beneficially, when air flow distribution uniformity increases, the fan assembly operates more efficiently, as air flow pressure losses due to flow separation are mitigated.

公开(公告)号：US20180352676A1

公开(公告)日：2018-12-06

申请号：US15994753

申请日：2018-05-31

Applicant: Apple Inc.

Inventor： Brett W. DEGNER ,  Eric R. PRATHER ,  William K. SMITH ,  Anthony Joseph AIELLO ,  Jesse T. DYBENKO ,  Arash NAGHIB LAHOUTI ,  Kristopher P. LAURENT

IPC: H05K7/20 ,  F28F1/32 ,  G06F1/20 ,  F04D25/16 ,  F04D29/42

Abstract: A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.

公开(公告)号：US20170094835A1

公开(公告)日：2017-03-30

申请号：US15199460

申请日：2016-06-30

Applicant: Apple Inc.

Inventor： Eric R. PRATHER ,  Clark E. WATERFALL ,  Reuben J. WILLIAMS ,  Vinh H. DIEP

IPC: H05K7/20 ,  F28F3/02 ,  F28D15/02

CPC classification number: H05K7/20154 ,  F28D15/0233 ,  F28F1/12 ,  F28F2250/08 ,  H01L23/427 ,  H01L23/467

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.