公开(公告)号：US20240068135A1

公开(公告)日：2024-02-29

申请号：US18504549

申请日：2023-11-08

Applicant: Apple Inc.

Inventor： Kyle L. Chatham ,  Kathryn P. Crews ,  Didio V. Gomes ,  Benjamin J. Grena ,  Storrs T. Hoen ,  Steven J. Keating ,  David M. Kindlon ,  Daniel A. Podhajny ,  Andrew L. Rosenberg ,  Daniel D. Sunshine ,  Lia M. Uesato ,  Joseph B. Walker ,  Felix Binder ,  Bertram Wendisch ,  Martin Latta ,  Ulrich Schläpfer ,  Franck Robin ,  Michael Baumann ,  Helen Wächter Fischer

IPC: D03D1/00 ,  B23K1/00 ,  D03D41/00 ,  D03J1/00 ,  H05K1/03

CPC classification number: D03D1/0088 ,  B23K1/0008 ,  D03D41/00 ,  D03J1/00 ,  H05K1/038 ,  D10B2401/16 ,  D10B2401/18

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

公开(公告)号：US11913143B2

公开(公告)日：2024-02-27

申请号：US16809445

申请日：2020-03-04

Applicant: Apple Inc.

Inventor： Kyle L Chatham ,  Kathryn P. Crews ,  Didio V. Gomes ,  Benjamin J. Grena ,  Storrs T. Hoen ,  Steven J. Keating ,  David M. Kindlon ,  Daniel A. Podhajny ,  Andrew L. Rosenberg ,  Daniel D. Sunshine ,  Lia M. Uesato ,  Joseph B. Walker ,  Felix Binder ,  Bertram Wendisch ,  Martin Latta ,  Ulrich Schläpfer ,  Franck Robin ,  Michael Baumann ,  Helen Wächter Fischer

IPC: D03D1/00 ,  H05K1/03 ,  B23K1/00 ,  D03J1/00 ,  D03D41/00

CPC classification number: D03D1/0088 ,  B23K1/0008 ,  D03D41/00 ,  D03J1/00 ,  H05K1/038 ,  D10B2401/16 ,  D10B2401/18

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.

公开(公告)号：US20200283935A1

公开(公告)日：2020-09-10

申请号：US16809445

申请日：2020-03-04

Applicant: Apple Inc.

Inventor： Kyle L. Chatham ,  Kathryn P. Crews ,  Didio V. Gomes ,  Benjamin J. Grena ,  Storrs T. Hoen ,  Steven J. Keating ,  David M. Kindlon ,  Daniel A. Podhajny ,  Andrew L. Rosenberg ,  Daniel D. Sunshine ,  Lia M. Uesato ,  Joseph B. Walker ,  Felix Binder ,  Bertram Wendisch ,  Martin Latta ,  Ulrich Schläpfer ,  Franck Robin ,  Michael Baumann ,  Helen Wächter Fischer

IPC: D03D1/00 ,  H05K1/03

Abstract: Interlacing equipment may be used to form fabric and to create a gap in the fabric. The fabric may include one or more conductive strands. An insertion tool may be used to align an electrical component with the conductive strands during interlacing operations. A soldering tool may be used to remove insulation from the conductive strands to expose conductive segments on the conductive strands. The soldering tool may be used to solder the conductive segments to the electrical component. The solder connections may be located in grooves in the electrical component. An encapsulation tool may dispense encapsulation material in the grooves to encapsulate the solder connections. After the electrical component is electrically connected to the conductive strands, the insertion tool may position and release the electrical component in the gap. A component retention tool may temporarily be used to retain the electrical component in the gap as interlacing operations continue.