公开(公告)号：US20240310635A1

公开(公告)日：2024-09-19

申请号：US18671793

申请日：2024-05-22

Applicant: Apple Inc.

Inventor： James E Pedder ,  Patrick B Bennett ,  Michael Slootsky ,  Graham B Myhre ,  Andrew Lin

IPC: G02B27/01 ,  H01L23/00 ,  H10K59/127

CPC classification number: G02B27/0172 ,  H01L24/83 ,  H10K59/127 ,  G02B2027/0123 ,  G09G2360/04

Abstract: A hybrid display may include different display portions with different resolutions. The high resolution display portion may be positioned in a main viewing area for the viewer whereas the low resolution display portion may be positioned in a peripheral viewing area. The high resolution display portion may have a silicon backplane. The low resolution display portion may have a different type of backplane such as a thin-film transistor backplane. The different display portions may optionally share a common organic light-emitting diode layer such that light is emitted from the same plane across both display portions. The high resolution display portion may emit light through a transparent window in the low resolution display portion. A high resolution display may also be formed by separately forming a frontplane and a backplane. Conductive attachment structures such as indium bumps may be used to mechanically and electrically connect the backplane to the frontplane.

公开(公告)号：US20240081134A1

公开(公告)日：2024-03-07

申请号：US18329388

申请日：2023-06-05

Applicant: Apple Inc.

Inventor： James E Pedder ,  Patrick B Bennett ,  Michael Slootsky ,  Graham B Myhre ,  Andrew Lin ,  Cheuk Chi Lo ,  Guanjun Tan

IPC: H10K59/90 ,  H01L25/075 ,  H01L25/16 ,  H10K59/12 ,  H10K59/127

CPC classification number: H10K59/90 ,  H01L25/0753 ,  H01L25/167 ,  H10K59/1201 ,  H10K59/127

Abstract: A hybrid display may include different display portions with different resolutions. The high resolution display portion may be positioned in a main viewing area for the viewer whereas the low resolution display portion may be positioned in a peripheral viewing area. The high resolution display portion may have a silicon backplane. The low resolution display portion may have a different type of backplane such as a thin-film transistor backplane. The different display portions may optionally share a common organic light-emitting diode layer such that light is emitted from the same plane across both display portions. The high resolution display portion may emit light through a transparent window in the low resolution display portion. A high resolution display may also be formed by separately forming a frontplane and a backplane. Conductive attachment structures such as indium bumps may be used to mechanically and electrically connect the backplane to the frontplane.