公开(公告)号：US20240363825A1

公开(公告)日：2024-10-31

申请号：US18769472

申请日：2024-07-11

Applicant: Hefei BOE Ruisheng Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Chunjian LIU ,  Jian TIAN ,  Jie LEI ,  Yajun MA ,  Jianying ZHANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/54

Abstract: The present disclosure provides a driving backplane, a light emitting substrate, a backlight module, and a display apparatus, which belongs to the field of display technology. The driving backplane includes a base substrate, a driving layer and an encapsulation layer sequentially laminated. The driving layer has a pad for binding an electronic element and a raised block corresponding to the pad, the pad is located on a side of the corresponding raised block away from the base substrate (BP), and an orthographic projection of the pad on the base substrate is located within an orthographic projection of the corresponding raised block on the corresponding base substrate. The encapsulation layer has a binding opening. The pad and the raised block are located in the binding opening.

公开(公告)号：US20240363824A1

公开(公告)日：2024-10-31

申请号：US18766707

申请日：2024-07-09

Applicant: Hefei BOE Ruisheng Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Ningyu LUO ,  Zouming XU ,  Xintao WU ,  Jiawei XU ,  Jie WANG ,  Tingwei HAN ,  Wenzhuo TANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/124

Abstract: An array substrate includes a base substrate, a conductive layer on a side of the base substrate, a light adjustment layer on a side of the conductive layer away from the base substrate, a plurality of signal lines on a side of the base substrate away from the conductive layer, and a protective layer between the light adjustment layer and the base substrate. The conductive layer includes a plurality of pads electrically connected with electronic elements. An orthographic projection of at least part of the light adjustment layer on the base substrate does not overlap an orthographic projection of the conductive layer on the base substrate, and is located in gaps between orthographic projections of adjacent signal lines on the base substrate. An orthographic projection of the protective layer on the base substrate at least covers the orthographic projection of the at least part on the base substrate.

公开(公告)号：US20240363811A1

公开(公告)日：2024-10-31

申请号：US18508158

申请日：2023-11-13

Applicant: Bridgelux, Inc.

Inventor： Yi-Qun LI ,  Jingqiong ZHANG ,  JUNGANG ZHAO

IPC: H01L33/50 ,  C09K11/02 ,  C09K11/61 ,  C09K11/77 ,  H01L25/075

CPC classification number: H01L33/504 ,  C09K11/02 ,  C09K11/617 ,  C09K11/77342 ,  C09K11/77348 ,  H01L25/0753

Abstract: An LED package comprising: a housing comprising a two-dimensional array of cups comprising a first cup for a first LED, a second cup for a second LED, a third cup for a third LED, and a fourth cup for a fourth LED; and a lead frame comprising respective anode and cathode regions for each cup. Each anode region comprises an anode electrode on a floor of the cup and an anode terminal for providing power to the anode electrode, and each cathode region comprises a cathode electrode on the floor of the cup and a cathode terminal for providing power to the cathode electrode, and wherein the respective anode and cathode terminals for each cup are located along opposing edges of the housing and are aligned with each other.

公开(公告)号：US20240363599A1

公开(公告)日：2024-10-31

申请号：US18681521

申请日：2022-08-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Can WANG ,  Qi QI ,  Wei LI ,  Can ZHANG ,  Minghua XUAN ,  Jinfei NIU ,  Jingjing ZHANG

IPC: H01L25/075 ,  H01L21/683 ,  H01L33/00 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L21/6835 ,  H01L33/0093 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68386 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A method for preparing the display substrate includes: providing a first substrate, and forming a light emitting chip layer on the first substrate to form a first backplane, wherein the light emitting chip layer includes: light emitting chips arranged in array, which are configured to emit light of a first color and include N sub-pixels, and N is a positive integer greater than or equal to 1; providing a second substrate, and forming a drive circuit layer on the second substrate to form a second backplane, wherein the drive circuit layer includes: connection electrodes arranged in an array, and the light emitting chips correspond to the connection electrodes one-by-one; transferring the first backplane from which the first substrate is peeled off to the second backplane; forming an optical film layer on a side of the light emitting chip layer away from the second backplane.

公开(公告)号：US12132156B2

公开(公告)日：2024-10-29

申请号：US17512649

申请日：2021-10-27

Applicant: Au Optronics Corporation

Inventor： Cheng-He Ruan ,  Jian-Jhou Tseng ,  Chih-Yuan Hou

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/005

Abstract: A display device includes a flexible substrate, a bonding pad, a light-emitting diode, an encapsulant, and a support structure. The bonding pad and the light-emitting diode are located on the flexible substrate. The encapsulant covers the light-emitting diode. The support structure is laterally located between the light-emitting diode and the bonding pad. The support structure has an inclined surface, and a thickness of the support structure close to the light-emitting diode is greater than the thickness of the support structure close to the bonding pad.

公开(公告)号：US12132144B2

公开(公告)日：2024-10-29

申请号：US18527387

申请日：2023-12-04

Applicant: PlayNitride Display Co., Ltd.

Inventor： Bo-Wei Wu ,  Yu-Yun Lo ,  Chien-Chen Kuo ,  Chang-Feng Tsai ,  Tzu-Yang Lin

IPC: H01L33/00 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L33/0095 ,  H01L21/6835 ,  H01L22/22 ,  H01L25/0753 ,  H01L33/62 ,  G09G3/32 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2933/0066

Abstract: A manufacturing method of an electronic element module is provided. The method includes: disposing a plurality of first micro-light-emitting diodes on a first temporary substrate; and replacing at least one defective micro-light-emitting diode of the first micro-light-emitting diodes with at least one second micro-light-emitting diode. The first micro-light-emitting diodes and at least one second micro-light-emitting diode are distributed on the first temporary substrate. The first micro-light-emitting diodes and at least one second micro-light-emitting diode have same properties, and at least one of the appearance difference, the height difference and the orientation difference exists between the first micro-light-emitting diodes and at least one second micro-light-emitting diode. A semiconductor structure and a display panel are also provided.

公开(公告)号：US12130975B2

公开(公告)日：2024-10-29

申请号：US18347516

申请日：2023-07-05

Applicant: Apple Inc.

Inventor： Paul X. Wang ,  Alex J. Lehmann ,  Qiliang Xu ,  Richard G. Huizar

IPC: G06F3/041 ,  F21V33/00 ,  G06F1/16 ,  G06F3/01 ,  G06F3/02 ,  G06F3/0362 ,  G09F13/06 ,  G09F13/08 ,  F21Y115/10 ,  G09F13/04 ,  H01L25/075 ,  H01L31/16

CPC classification number: G06F3/041 ,  F21V33/0052 ,  G06F1/1692 ,  G06F3/016 ,  G06F3/0202 ,  G06F3/0362 ,  G09F13/06 ,  G09F13/08 ,  F21Y2115/10 ,  G06F1/1616 ,  G06F1/1626 ,  G09F13/0463 ,  H01L25/0753 ,  H01L31/16

Abstract: Embodiments are directed to an electronic device having a hidden or concealable input region. In one aspect, an embodiment includes an enclosure having a wall that defines an input region having an array of microperforations. A light source may be positioned within a volume defined by the enclosure and configured to propagate light through the array of microperforations. A sensing element may be coupled with the wall and configured to detect input received within the input region. The array of microperforations are configured to be visually imperceptible when not illuminated by the light source. When illuminated by the light source, the array of microperforations may display a symbol.

公开(公告)号：US20240355976A1

公开(公告)日：2024-10-24

申请号：US18572838

申请日：2022-01-07

Applicant: XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY CO., LTD.

Inventor： Yong FAN

IPC: H01L33/60 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L2933/0058

Abstract: Some embodiments of the present application provide a display unit including: a substrate; a light-emitting device disposed on the substrate; a reflective barrier layer arranged on the substrate. The reflective barrier layer is provided with a light exit hole arranged correspondingly to the light-emitting device. A first projection is defined by an orthographic projection of the light exit hole in a plane vertical to a light-emitting surface of the light-emitting device, and an angle included between a contour line of the first projection corresponding to a side of a peripheral wall of the light exit hole is different from another angle included between another contour line of the first projection corresponding to an opposite side of the peripheral wall of the light exit hole.

公开(公告)号：US20240355974A1

公开(公告)日：2024-10-24

申请号：US18575177

申请日：2021-10-29

Applicant: Yunnan Invensight Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Zhijian ZHU ,  Pengcheng LU ,  Yunlong LI ,  Dongsheng LI ,  Dacheng ZHANG ,  Shengji YANG ,  Kuanta YANG ,  Xiaochuan CHEN

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/62 ,  H01L2933/0058

Abstract: A display apparatus, and a display panel and a manufacturing method therefor. The display panel includes a driving backplane and a plurality of light-emitting modules on one side of the driving backplane, the driving backplane is provided with a pixel region including a central region and n offset regions, and n is a positive integer. Each light-emitting module includes a plurality of light-emitting units, and each light-emitting unit includes a corresponding light-emitting device and a corresponding converging lens; in any light-emitting unit of an offset region, the center of a light-emitting device is offset to the side of the center of a converging lens away from the central region, so as to obtain an offset amount and an offset direction; the offset amounts of light-emitting units of a same offset region are the same; the offset directions of light-emitting units of a same light-emitting module are the same.

公开(公告)号：US20240355789A1

公开(公告)日：2024-10-24

申请号：US18688458

申请日：2022-03-25

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION ,  SONY GROUP CORPORATION

Inventor： Katsuhiro TOMODA ,  Kazuya UEDA ,  Atsushi YASUDA ,  Goshi BIWA ,  Hiroki NAITO ,  Ippei NISHINAKA ,  Akira OHMAE

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0083

Abstract: Provided are a light emitting element array, a light emitting device, an electronic device, and a photonic crystal structure which are improved in stray light suppression, high luminance, and low power consumption. A light emitting element array includes a plurality of a light emitting element including a light emitting surface, in which a plurality of a light emitting unit is formed including at least one of the light emitting element and capable of controlling light emission from the light emitting surface of the light emitting element, and the plurality of the light emitting unit is provided with an optical adjustment layer at least partially including a periodic structure portion in which a refractive index periodically changes.