公开(公告)号：US20240080976A1

公开(公告)日：2024-03-07

申请号：US18458747

申请日：2023-08-30

Applicant: Apple Inc.

Inventor： Peter A. Dvorak ,  Eric W. Bates ,  Ana Papio Toda ,  Yiren Wang ,  Hao Xu ,  Yuan Tao ,  Han Wang ,  Jack R Lanzi ,  Ronald Lam

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/14

CPC classification number: H05K1/11 ,  H05K1/028 ,  H05K1/181 ,  H05K5/0217 ,  H05K7/1427 ,  H04R1/02 ,  H05K2201/0141 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.

公开(公告)号：US20240079790A1

公开(公告)日：2024-03-07

申请号：US18458726

申请日：2023-08-30

Applicant: Apple Inc.

Inventor： Peter A Dvorak ,  Eric W Bates ,  McKinley McQuaide ,  Ronald Lam ,  Ana Papio Toda ,  Yiren Wang ,  Hao Xu ,  Han Wang ,  Yuan Tao ,  Jack R Lanzi ,  Jingni Zhong

IPC: H01Q13/18 ,  H04R9/02

CPC classification number: H01Q13/18 ,  H04R9/02 ,  H01Q1/241

Abstract: An electronic device may be provided with peripheral conductive housing structures having a segment that forms a resonating element for an antenna. A speaker may be mounted to a mid-chassis of the electronic device. A printed circuit may be mounted to the speaker and may have a ground trace for the antenna. A conductive spring may extend through the printed circuit and the speaker to couple the ground trace to the mid-chassis. A conductive contact pad may be welded to an aluminum layer such as an aluminum layer used to form the mid-chassis. A conductive spring such as the conductive spring coupled to the ground traces may press against the contact pad. The contact pad may include gold or nickel-plated stainless steel. The contact pad may provide a strong electrical connection between the conductive spring and the aluminum layer.