Ultra-wideband Antenna Assembly
    2.
    发明公开

    公开(公告)号:US20240079782A1

    公开(公告)日:2024-03-07

    申请号:US18458916

    申请日:2023-08-30

    申请人: Apple Inc.

    IPC分类号: H01Q7/00 H01Q1/38 H01Q1/48

    CPC分类号: H01Q7/00 H01Q1/38 H01Q1/48

    摘要: An electronic device may be provided with a housing and an antenna. The antenna may be on a first substrate mounted to a second substrate. The housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. The second substrate may be mounted to the mid-chassis. The antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. The conductive plate may have an opening aligned with the conductive patch. The first substrate may be separated from the dielectric cover by an air gap. A conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. The antenna may convey ultra-wideband (UWB) signals through the air gap, the opening, and the dielectric cover layer.

    Impedance Transitions Between Boards for Antennas

    公开(公告)号:US20240079761A1

    公开(公告)日:2024-03-07

    申请号:US18458835

    申请日:2023-08-30

    申请人: Apple Inc.

    IPC分类号: H01Q1/24 H01Q1/48

    CPC分类号: H01Q1/243 H01Q1/48 H01Q9/0407

    摘要: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.

    Electronic Device with Multi-Feed Antenna Structures

    公开(公告)号:US20240079766A1

    公开(公告)日:2024-03-07

    申请号:US18458949

    申请日:2023-08-30

    申请人: Apple Inc.

    IPC分类号: H01Q1/38 H01Q1/50 H01Q13/10

    CPC分类号: H01Q1/38 H01Q1/50 H01Q13/10

    摘要: An electronic device may be provided with peripheral conductive housing structures having a first segment and a second segment. First and second antenna feeds may be coupled between the first segment and the ground structures. The first feed may convey signals in a first band and the second feed may convey signals in a second band. The first segment may be near-field coupled to a slot between the second segment and the ground structures. A first tuner may be coupled between the second segment and the ground structures and may adjust a resonance of the first segment in the first and second bands. A second tuner coupled to the first feed may perform impedance matching in the first band and aperture tuning in the second band. A third tuner coupled to the second feed may perform impedance matching in the second band and aperture tuning in the first band.

    Electronic Device with Antenna Grounding Springs and Pads

    公开(公告)号:US20240079790A1

    公开(公告)日:2024-03-07

    申请号:US18458726

    申请日:2023-08-30

    申请人: Apple Inc.

    IPC分类号: H01Q13/18 H04R9/02

    CPC分类号: H01Q13/18 H04R9/02 H01Q1/241

    摘要: An electronic device may be provided with peripheral conductive housing structures having a segment that forms a resonating element for an antenna. A speaker may be mounted to a mid-chassis of the electronic device. A printed circuit may be mounted to the speaker and may have a ground trace for the antenna. A conductive spring may extend through the printed circuit and the speaker to couple the ground trace to the mid-chassis. A conductive contact pad may be welded to an aluminum layer such as an aluminum layer used to form the mid-chassis. A conductive spring such as the conductive spring coupled to the ground traces may press against the contact pad. The contact pad may include gold or nickel-plated stainless steel. The contact pad may provide a strong electrical connection between the conductive spring and the aluminum layer.