INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING
    1.
    发明申请
    INTERNAL COMPONENT ARRANGEMENT WITHIN A HOUSING 审中-公开
    内部组件在房屋中的安排

    公开(公告)号:US20170013738A1

    公开(公告)日:2017-01-12

    申请号:US15273574

    申请日:2016-09-22

    Applicant: Apple Inc.

    Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.

    Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中,许多插入模制的保持构件用于在跌落事件期间抑制壳体的侧壁的向外变形。 在另一个实施例中,利用整流罩将多个板对板连接器保持在印刷电路板(PCB)上的通信槽内。 在另一个实施例中,使用具有直径相对的突起的C形垫圈来调节内部部件的对准。

    COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS
    2.
    发明申请
    COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS 有权
    紧凑形式因子集成电路卡和方法

    公开(公告)号:US20140106819A1

    公开(公告)日:2014-04-17

    申请号:US14133536

    申请日:2013-12-18

    Applicant: Apple Inc.

    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (0.10 mm)×0.67 mm (+0.03/−0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.

    Abstract translation: 紧凑型外形尺寸集成电路卡。 在一个实施例中,公开了用户识别模块(SIM)卡。 在一个实施例中,SIM卡具有针对特定应用而优化的整体尺寸; 例如12.30mm(±0.10mm)×8.80mm(0.10mm)×0.67mm(±0.03 / -0.07)。 在另一实施例中,SIM卡具有11.90mm(±0.10mm)×8.80mm(±0.10mm)×0.70mm(最大)的总体尺寸。 还公开了多种互补的SIM卡适配器和使用方法。

    COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS
    3.
    发明申请
    COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS 审中-公开
    紧凑形式因子集成电路卡和方法

    公开(公告)号:US20150014421A1

    公开(公告)日:2015-01-15

    申请号:US14503018

    申请日:2014-09-30

    Applicant: Apple Inc.

    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (0.10 mm)×0.67 mm (+0.03/−0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.

    Abstract translation: 紧凑型外形尺寸集成电路卡。 在一个实施例中,公开了用户识别模块(SIM)卡。 在一个实施例中,SIM卡具有针对特定应用而优化的整体尺寸; 例如12.30mm(±0.10mm)×8.80mm(0.10mm)×0.67mm(±0.03 / -0.07)。 在另一实施例中,SIM卡具有11.90mm(±0.10mm)×8.80mm(±0.10mm)×0.70mm(最大)的总体尺寸。 还公开了多种互补的SIM卡适配器和使用方法。

    SPACE-EFFICIENT FLEX CABLE WITH IMPROVED SIGNAL INTEGRITY FOR A PORTABLE ELECTRONIC DEVICE

    公开(公告)号:US20190082529A1

    公开(公告)日:2019-03-14

    申请号:US16127071

    申请日:2018-09-10

    Applicant: Apple Inc.

    Abstract: This application relates to a flexible cable for a portable electronic device, where the portable electronic device includes operational components having connectors that are capable of being electrically coupled to the flexible cable. The flexible cable includes a dielectric substrate having a generally planar shape, an upper grounding plane, a lower grounding plane, and a first signal transmission line that is separated by the upper and lower grounding planes, where the dielectric substrate is capable of electromagnetically shielding the first signal transmission line.

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