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    Methods for forming hermetically-sealed packages including feedthrough assemblies
    2.
    发明授权
    Methods for forming hermetically-sealed packages including feedthrough assemblies 有权

    公开(公告)号：US11950387B2

    公开(公告)日：2024-04-02

    申请号：US17074171

    申请日：2020-10-19

    申请人： Medtronic, Inc.

    发明人： David A. Ruben

    IPC分类号： H05K5/06 ,  A61N1/375 ,  H05K3/38 ,  H05K7/06

    CPC分类号： H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K5/06 ,  H05K7/06 ,  H05K2203/107

    摘要： Methods of forming hermetically-sealed packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES
    3.
    发明申请
    HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES 审中-公开

    公开(公告)号：US20190166709A1

    公开(公告)日：2019-05-30

    申请号：US16192933

    申请日：2018-11-16

    申请人： Medtronic, Inc.

    发明人： David A. RUBEN

    IPC分类号： H05K5/06 ,  A61N1/375 ,  H05K7/06 ,  H05K3/38

    CPC分类号： H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K7/06 ,  H05K2203/107

    摘要： Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    FIXING STRUCTURE OF ELECTRONIC DEVICE
    5.
    发明申请
    FIXING STRUCTURE OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180166805A1

    公开(公告)日：2018-06-14

    申请号：US15444006

    申请日：2017-02-27

    申请人： JIANGYIN SINBON ELECTRONICS CO., LTD.

    发明人： Jen-Shing CHEN ,  Xue Feng ZHANG ,  Jian ZHOU

    IPC分类号： H01R12/70 ,  H01R12/73

    CPC分类号： H01R12/7005 ,  H01R12/737 ,  H05K3/301 ,  H05K3/306 ,  H05K7/06 ,  H05K2201/09063 ,  H05K2201/10053

    摘要： A fixing structure of electronic components has a first substrate, at least one second substrate, at least one electronic component, and at least one fixing mechanism. Each second substrate has at least two first pins to electrically connect to the first substrate. Multiple second pins formed on a side surface of the electronic component are electrically connected to the second substrate. The at least one fixing mechanism covers the at least one electronic component and the at least one second substrate. A first mounting part and a second mounting part respectively extend downward from opposite sides of the at least one fixing mechanism for clamping the electronic component and the second substrate so that the at least one electronic component and the at least one second substrate are erectly mounted on the first substrate. Thus, more electronic components are allowed to be erectly mounted on the first substrate.

    Welding and soldering of transistor leads
    8.
    发明授权
    Welding and soldering of transistor leads 有权

    公开(公告)号：US09642276B2

    公开(公告)日：2017-05-02

    申请号：US14557381

    申请日：2014-12-01

    申请人： Tesla Motors, Inc.

    发明人： Robert James Ramm ,  Dino Sasaridis ,  Colin Campbell ,  Wenjun Liu

    IPC分类号： H05K7/06 ,  H05K3/34 ,  H05K7/14

    CPC分类号： H05K7/06 ,  H05K3/3447 ,  H05K7/1432

    摘要： In a method of manufacturing an electronic device a transistor having respective input, output and control leads extending parallel to each other is positioned; first and second busbar layers are placed relative to the transistor so that a first tab extending from the first opening aligns with and contacts one of the input and output leads, and so that a second tab extending from the second opening aligns with and contacts another one of the input and output leads; the first tab and one of the input and output leads are welded; a circuit board is placed parallel to the busbar layers so that the control lead and the first and second tabs extend through corresponding openings in the circuit board; and the control lead and the at least one of the first and second tabs are soldered to one or more circuits on the circuit board.

    CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX
    9.
    发明申请
    CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX 有权
    电路组件和电连接盒

    公开(公告)号：US20170054283A1

    公开(公告)日：2017-02-23

    申请号：US15306661

    申请日：2015-04-27

    申请人： AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

    发明人： Takehito Kobayashi ,  Yoshikazu Sasaki ,  Shigeki Yamane ,  Tomohiro Ooi ,  Yukinori Kita

    IPC分类号： H02G3/16 ,  H05K1/18 ,  H05K7/06 ,  H05K1/02

    CPC分类号： H02G3/16 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/06 ,  H05K7/20854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10272

    摘要： Provided is a circuit assembly that includes a circuit board that has a connection opening, a plurality of busbars that are laminated on one surface side of the circuit board via an adhesive sheet, a coil that has a main portion and a plurality of lead terminals, the coil being arranged on the other surface side of the circuit board by the lead terminals being connected to the plurality of busbars that are exposed through the connection opening, and a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent. The adhesive sheet has sheet openings through which the plurality of busbars are exposed and the plurality of lead terminals are connected to the plurality of busbars, the adhesive sheet covering a gap between the plurality of busbars, the gap being located in the connection opening.

    摘要翻译： 提供一种电路组件，其包括具有连接开口的电路板，经由粘合片层叠在电路板的一个表面侧上的多个汇流条，具有主要部分和多个引线端子的线圈， 所述线圈被布置在所述电路板的另一表面侧，所述引线端子连接到通过所述连接开口暴露的所述多个母线，以及散热器，所述散热器层压在所述多个母线的与所述多个母线相对的一侧上 电路板通过粘合剂。 粘合片具有多个母线露出的片状开口，多个引线端子与多个汇流条连接，该粘接片覆盖多个汇流条之间的间隙，该间隙位于连接口中。

    CONFORMAL POWER ADAPTER FOR LIGHTED ARTIFICIAL TREE
    10.
    发明申请
    CONFORMAL POWER ADAPTER FOR LIGHTED ARTIFICIAL TREE 有权

    公开(公告)号：US20160169493A1

    公开(公告)日：2016-06-16

    申请号：US14970118

    申请日：2015-12-15

    申请人： Willis Electric Co., Ltd.

    发明人： Johnny CHEN

    IPC分类号： F21V23/00 ,  F21S4/10 ,  F21V23/06 ,  F21V23/02

    CPC分类号： F21V23/009 ,  A47G33/06 ,  F21S4/10 ,  F21V23/004 ,  F21V23/02 ,  F21V23/06 ,  F21V33/0028 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K7/06 ,  Y10T29/49117

    摘要： A conformal power adapter for insertion into a lighted artificial tree and for converting power received from an external power source to a power usable by the lighted artificial tree. The power adapter includes an elongated housing including a first end, and a second end; a printed circuit board assembly including power-converting circuitry for converting an input electrical power to an output electrical power for use by a lighted artificial tree having a hollow trunk section, the printed circuit board assembly located substantially within the elongated housing; a power cord secured to the first end of the housing and in electrical connection with the power converting electronics, the power cord adapted to transmit power from an external power source to the power-converting circuitry. The elongated housing enclosing the printed circuit board assembly is sized to fit substantially within the hollow trunk portion of the lighted artificial tree.