Method for Processing Conductive Terminal and Electrical Assembly

    公开(公告)号:US20240250489A1

    公开(公告)日:2024-07-25

    申请号:US18412559

    申请日:2024-01-14

    Inventor: Zhenhua QI

    CPC classification number: H01R43/16 H01R12/58 H01R12/7064 H01R13/03 H01R43/205

    Abstract: A method for processing a conductive terminal and an electrical assembly is disclosed. The method for processing a conductive terminal includes (i) determining a contact region on a terminal to have a press-fit connection with a circuit board, the contact region including a tin-containing layer, (ii) generating laser light using one or more lasers, and projecting the laser light to the contact region, and (iii) subjecting the contact region to laser irradiation for a predetermined time, the tin-containing layer in the contact region undergoing melting, diffusion and re-solidification during the laser irradiation, and a tin-containing intermetallic compound being formed on an outer surface of the contact region. The method for processing a conductive terminal and the electrical assembly of the present disclosure have advantages such as simple implementation, convenient deployment, and good performance.

    JIG FOR ASSEMBLING CONNECTOR ASSEMBLY
    2.
    发明公开

    公开(公告)号:US20240213732A1

    公开(公告)日:2024-06-27

    申请号:US18515328

    申请日:2023-11-21

    Applicant: MOLEX, LLC

    CPC classification number: H01R43/205

    Abstract: A jig for assembling a connector assembly is proposed. The connector assembly includes a guide shielding cage and a heat sink which has been assembled on the guide shielding cage, the guide shielding cage includes two side walls which each have a pressed protrusion. The jig includes a pressing cover, two movable plates and a supporting spring. Each movable plate has a connecting portion disposed at an upper portion thereof, a pushed portion disposed below the connecting portion, and an acting construction w disposed below the pushed portion, the pressing cover is assembled with the connecting portions of the two movable plates in a manner that the pressing cover is capable of moving up and down relative to the two movable plates, the two movable plates are arranged laterally and are capable of moving between an unloading state where the two movable plates are away from each other and a loading state where the two movable plates are close to each other, the acting construction has a gripping portion which is inward and a pressing portion which is downward. The supporting spring is provided between the two movable plates. The pressing cover which is pressed downwardly is capable of pushing the pushed portions, so as to make the two movable plates move inwardly toward each other from the unloading state to the loading state, the gripping portions of the two movable plates inwardly grip the two side walls of the guide shielding cage respectively, the pressing portions of the two movable plates downwardly press on the pressed protrusions of the two side walls of the guide shielding cage respectively.

    Part gripping tool
    4.
    发明授权

    公开(公告)号:US11942747B2

    公开(公告)日:2024-03-26

    申请号:US17654982

    申请日:2022-03-15

    CPC classification number: H01R43/205 H05K13/0408 H05K13/0419 H05K13/0426

    Abstract: A component gripping tool including: a pair of claws configured to grip multiple pins or leads of an electronic component; a contact surface provided between the pair of claws and configured to contact a leading end of at least two of the multiple pins or leads being gripped by the pair of claws, wherein an escape section is formed in the contact surface such that the pair of claws and the contact surface do not interfere with each other when the pair of claws is gripping the two multiple pins or leads.

    Substrate unit and manufacturing method of substrate unit

    公开(公告)号:US11942712B2

    公开(公告)日:2024-03-26

    申请号:US17558593

    申请日:2021-12-22

    Inventor: Masashi Suzuki

    CPC classification number: H01R12/716 H01R12/52 H01R43/205

    Abstract: A substrate unit includes a first connector including a first terminal and a first housing accommodating the first terminal, and to be connected to an external connector, a first substrate on which the first connector is mounted, a second connector including a second terminal and a second housing accommodating the second terminal, and to be connected to the external connector, a second substrate on which the second connector is mounted and a case accommodating the first substrate and the second substrate. The first housing is provided with a first locking portion. The second housing is provided with a second locking portion. The first locking portion and the second locking portion are locked to each other. The first terminal and the second terminal are disposed to face an opening provided in the case through which the external connector is to be connected to the first connector and the second connector.

    ROBUST LOW PROFILE INTERPOSER
    8.
    发明公开

    公开(公告)号:US20240014584A1

    公开(公告)日:2024-01-11

    申请号:US18348684

    申请日:2023-07-07

    Inventor: Paul R. Taylor

    CPC classification number: H01R12/714 H01R13/2435 H01R43/205

    Abstract: A low profile interposer with multiple electrical contacts held in a housing. Each electrical contact is disposed within a respective opening of the housing. The electrical contact includes a base, a first beam extending from the base to a distal end of the first beam, a second beam extending from the base to a distal end of the second beam. When the electrical contact is in an uncompressed state, a first portion of the distal end of the first beam and a first portion of the distal end of the second beam are positioned between the top surface and the bottom surface; and a second portion of the distal end of the first beam extends above the top surface and a second portion of the distal end of the second beam extends below the bottom surface.

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