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公开(公告)号:US20250085179A1
公开(公告)日:2025-03-13
申请号:US18626075
申请日:2024-04-03
Applicant: Apple Inc.
Inventor: Michael J. GLICKMAN , Kuolung LEI , Gregory B. ARNDT
Abstract: Aspects of the subject technology relate to electronic devices with pressure sensors having an integrated fluid cavity. The electronic device includes a housing having an opening. The electronic device also includes a pressure sensor disposed within the housing and adjacent to the opening. The pressure sensor includes a substrate and a sensing membrane disposed on the substrate that is configured to obtain pressure data. The pressure sensor also includes a membrane support disposed on the substrate and an outer membrane disposed on the membrane support. The pressure sensor also includes reference cavity formed between the sensing membrane and the substrate. The pressure sensor also includes a fluid cavity disposed between the sensing membrane and the outer membrane. In some aspects, the outer membrane forms a hermetic seal around the fluid cavity. In other aspects, the outer membrane has a stiffness that is lesser than the sensing membrane.
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2.
公开(公告)号:US20200223686A1
公开(公告)日:2020-07-16
申请号:US16831706
申请日:2020-03-26
Applicant: Apple Inc.
Inventor: Krishna Prasad VUMMIDI MURALI , Kuolung LEI , Richard YEH , Yun X. MA
Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.
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3.
公开(公告)号:US20190100428A1
公开(公告)日:2019-04-04
申请号:US16147537
申请日:2018-09-28
Applicant: Apple Inc.
Inventor: Krishna Prasad VUMMIDI MURALI , Kuolung LEI , Richard YEH , Yun X. MA
Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.
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