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    PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST
    1.
    发明公开
    PACKAGES AND PROCESSES FOR RADIO FREQUENCY MITIGATION AND SELF-TEST 审中-公开

    公开(公告)号：US20240094779A1

    公开(公告)日：2024-03-21

    申请号：US18359298

    申请日：2023-07-26

    Applicant: Apple Inc.

    Inventor： Krishna Prasad VUMMIDI MURALI

    IPC: G06F1/16 ,  G01R31/28

    CPC classification number: G06F1/1656 ,  G01R31/2827

    Abstract: A semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. The circuitry includes chokes between the I/O pads of the package and a sensor module in the package to attenuate high-frequency RF interference in the package and protect sensors in the package. Each I/O pad may have a corresponding choke. During a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and the sensor module and coupled between a current source and a ground. A current can be supplied to the choke to raise the temperature of the package. The chokes may use high-resistance windings to increase heat generation during the self-test procedure.

    SEAL-INTEGRITY DIAGNOSTIC SYSTEM
    2.
    发明公开
    SEAL-INTEGRITY DIAGNOSTIC SYSTEM 审中-公开

    公开(公告)号：US20240295457A1

    公开(公告)日：2024-09-05

    申请号：US18426198

    申请日：2024-01-29

    Applicant: Apple Inc.

    Inventor： Ankur AGRAWAL ,  Krishna Prasad VUMMIDI MURALI ,  Michael J. GLICKMAN ,  Roberto M. RIBEIRO ,  Terrance P. KAO ,  Vincenzo COSTANZA

    IPC: G01M3/32 ,  G01M13/005

    CPC classification number: G01M3/3272 ,  G01M13/005

    Abstract: An apparatus of the subject technology includes a housing, a first sensor to obtain a first measurement, an optional second sensor to obtain a second measurement, and a processor to determine a seal-quality metric of the housing based on the first measurement and the second measurement. The first sensor can include an internal pressure sensor disposed inside the housing, and the first measurement can include measurement of an internal pressure of the housing. The second sensor can include an external pressure sensor disposed at an outside wall of the housing, and the second measurement can include measurement of an external pressure.

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