公开(公告)号：US20250157936A1

公开(公告)日：2025-05-15

申请号：US19020976

申请日：2025-01-14

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Ravindranath T. Kollipara

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Multi-chip modules and methods of fabrication are described. The MCM may include a plurality of dies in which die-to-die routing can be partitioned within multiple metal routing layers for shorter die-to-die routings, while longer die-to-die routing can be routed primarily in a single metal routing layer. The plurality of dies may also be arranged in a spaced apart relationship to accommodate additional wiring area, while preserving direct routing areas for the longer die-to-die routing.

公开(公告)号：US12237269B2

公开(公告)日：2025-02-25

申请号：US17655157

申请日：2022-03-16

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Ravindranath T. Kollipara

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Multi-chip modules and methods of fabrication are described. The MCM may include a plurality of dies in which die-to-die routing can be partitioned within multiple metal routing layers for shorter die-to-die routings, while longer die-to-die routing can be routed primarily in a single metal routing layer. The plurality of dies may also be arranged in a spaced apart relationship to accommodate additional wiring area, while preserving direct routing areas for the longer die-to-die routing.

公开(公告)号：US20230299007A1

公开(公告)日：2023-09-21

申请号：US17655157

申请日：2022-03-16

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Ravindranath T. Kollipara

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/5381 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/17 ,  H01L23/5389 ,  H01L2924/1432 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/30105 ,  H01L2924/30205 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1601 ,  H01L2224/1703

Abstract: Multi-chip modules and methods of fabrication are described. The MCM may include a plurality of dies in which die-to-die routing can be partitioned within multiple metal routing layers for shorter die-to-die routings, while longer die-to-die routing can be routed primarily in a single metal routing layer. The plurality of dies may also be arranged in a spaced apart relationship to accommodate additional wiring area, while preserving direct routing areas for the longer die-to-die routing.