公开(公告)号：US20190081362A1

公开(公告)日：2019-03-14

申请号：US15857099

申请日：2017-12-28

Applicant: Apple Inc.

Inventor： Jonathan C. Wilson ,  Tianhao Li ,  Nathan J. Bohney

IPC: H01M10/42 ,  H01R12/79 ,  H05K5/00 ,  H01M2/10 ,  H01M10/48

Abstract: An over-molded printed circuit board may be used in a battery pack. The over-molded printed circuit board can include a printed circuit board having electronic components, such as battery management circuitry, disposed thereon. A flex connector can be attached to the printed circuit board. An over-mold can formed about the printed circuit board, for example, by injection molding an epoxy resin, polyamide, or other suitable material. The over-mold may facilitate routing of the flex connector at a desired angle from the battery back and may also have a geometry that provides a supporting mechanical interface between the cells of the battery pack and the printed circuit board. Battery packs so constructed may be installed in electronic devices, such as mobile telephones, smart phones, tablet computers, laptop computers, media players, etc.