公开(公告)号：US20220278255A1

公开(公告)日：2022-09-01

申请号：US17648101

申请日：2022-01-14

Applicant: Apple Inc.

Inventor： Yuewei Zhang ,  Fang Ou ,  Lei Zhang ,  Lina He ,  Paul S. Drzaic ,  Xiaobin Xin

IPC: H01L33/38 ,  H01L33/62 ,  G09G3/32

Abstract: Display structures and methods of operation with micro light emitting diode (LED) sidewall gating are described. In an embodiment, a display structure includes a vertically oriented micro LED mounted on a display substrate, in which the micro LED includes a p-n diode with top and bottom electrode sides, and a sidewall gate electrode spanning a sidewall of the p-n diode where the active layer is included. In various embodiments, a bias may be applied to the sidewall gate electrode while driving the micro LED to deplete a minority carrier concentration from the sidewall of the p-n diode.

公开(公告)号：US12153233B1

公开(公告)日：2024-11-26

申请号：US17465458

申请日：2021-09-02

Applicant: Apple Inc.

Inventor： Xiaobin Xin ,  Dmitry S. Sizov ,  Fang Ou ,  Lei Zhang ,  Lina He ,  Nathaniel T. Lawrence ,  Paul S. Drzaic ,  Ranojoy Bose ,  Yuewei Zhang

IPC: G02B5/18 ,  H01L27/15 ,  H01L31/0232 ,  H01L33/58

Abstract: Optical components such as components that emit light and components that detect light may be provided. Optical components that emit light may include displays having arrays of display pixels with respective light-emitting devices such as crystalline semiconductor light-emitting diodes. Optical components that detect light may include image sensors or other components with arrays of photodetectors. The light-emitting devices and photodetectors in the optical components may be overlapped by metalenses such as multielement metalenses. A multielement metalens may have a first metalens element formed from a first layer of nanostructures arranged and an overlapping second metalens element formed from a second layer of nanostructures. Light sources may be provided on a semiconductor and metalens nanostructures may be formed on an opposing surface of the semiconductor.

公开(公告)号：US20220285577A1

公开(公告)日：2022-09-08

申请号：US17649018

申请日：2022-01-26

Applicant: Apple Inc.

Inventor： Lei Zhang ,  Fang Ou ,  Lina He ,  Paul S. Drzaic ,  Dmitry S. Sizov ,  Ranojoy Bose ,  Yuewei Zhang ,  Xiaobin Xin ,  Nathaniel T. Lawrence ,  Wei H. Yao

IPC: H01L33/00 ,  H01L25/16

Abstract: Methods and structures are described to facilitate the transfer of device layer coupons with controlled vertical position. In an embodiment, a plurality of device layer coupons is bonded to a receiving substrate with an adhesive layer, where distance between front surfaces of the plurality of device layer coupons and a bulk layer of the receiving substrate is controlled by a plurality of rigid mechanical spacers.