公开(公告)号：US20240347516A1

公开(公告)日：2024-10-17

申请号：US18611108

申请日：2024-03-20

Applicant: Apple Inc.

Inventor： Dmitry S. Sizov ,  Ion Bita ,  Jean-Jacques P. Drolet ,  John T. Leonard ,  Jonathan S. Steckel ,  Nathaniel T. Lawrence ,  Xiaobin Xin ,  Ranojoy Bose

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H01L33/00 ,  H01L33/38 ,  H01L33/60

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/32 ,  H01L24/73 ,  H01L25/167 ,  H01L25/18 ,  H01L33/60 ,  H01L33/0008 ,  H01L33/0093 ,  H01L33/38 ,  H01L2224/08225 ,  H01L2224/32225

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.

公开(公告)号：US20230018406A1

公开(公告)日：2023-01-19

申请号：US17809785

申请日：2022-06-29

Applicant: Apple Inc.

Inventor： Dmitry S. Sizov ,  Ion Bita ,  Jean-Jacques P. Drolet ,  John T. Leonard ,  Jonathan S. Steckel ,  Nathaniel T. Lawrence ,  Xiaobin Xin ,  Ranojoy Bose

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H01L33/60

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.

公开(公告)号：US11967586B2

公开(公告)日：2024-04-23

申请号：US17809785

申请日：2022-06-29

Applicant: Apple Inc.

Inventor： Dmitry S. Sizov ,  Ion Bita ,  Jean-Jacques P. Drolet ,  John T. Leonard ,  Jonathan S. Steckel ,  Nathaniel T. Lawrence ,  Xiaobin Xin ,  Ranojoy Bose

IPC: H01L25/075 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H01L33/60 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L24/08 ,  H01L24/32 ,  H01L24/73 ,  H01L25/167 ,  H01L25/18 ,  H01L33/60 ,  H01L33/0008 ,  H01L33/0093 ,  H01L33/38 ,  H01L2224/08225 ,  H01L2224/32225

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.

公开(公告)号：US11908846B1

公开(公告)日：2024-02-20

申请号：US17009158

申请日：2020-09-01

Applicant: Apple Inc.

Inventor： Yung-Yu Hsu ,  Chaohao Wang ,  Jonathan C. Moisant-Thompson ,  Kuan H. Lu ,  Mingjing Ha ,  Paul S. Drzaic ,  Yang Li ,  Yi-Pai Huang ,  Nathaniel T. Lawrence

IPC: H01L25/16

CPC classification number: H01L25/167

Abstract: A display may include light-emitting components such as light-emitting diodes on a transparent substrate. Conductive signal paths between the light-emitting components, driver integrated circuits for controlling the light-emitting components, and the light-emitting components themselves may be opaque. To mitigate diffraction artifacts caused by the opaque components, the opaque footprint of the display may be selected to include non-periodic portions. The non-periodic portions increase randomness and reduce periodicity within the opaque footprint, which mitigates perceptible diffraction artifacts when viewing the display. One or both of the component mounting portions and interconnect portions of the opaque footprint may be non-periodic. The component mounting portions may have random shapes. The interconnect portions may follow random paths between the component mounting portions.

公开(公告)号：US12153233B1

公开(公告)日：2024-11-26

申请号：US17465458

申请日：2021-09-02

Applicant: Apple Inc.

Inventor： Xiaobin Xin ,  Dmitry S. Sizov ,  Fang Ou ,  Lei Zhang ,  Lina He ,  Nathaniel T. Lawrence ,  Paul S. Drzaic ,  Ranojoy Bose ,  Yuewei Zhang

IPC: G02B5/18 ,  H01L27/15 ,  H01L31/0232 ,  H01L33/58

Abstract: Optical components such as components that emit light and components that detect light may be provided. Optical components that emit light may include displays having arrays of display pixels with respective light-emitting devices such as crystalline semiconductor light-emitting diodes. Optical components that detect light may include image sensors or other components with arrays of photodetectors. The light-emitting devices and photodetectors in the optical components may be overlapped by metalenses such as multielement metalenses. A multielement metalens may have a first metalens element formed from a first layer of nanostructures arranged and an overlapping second metalens element formed from a second layer of nanostructures. Light sources may be provided on a semiconductor and metalens nanostructures may be formed on an opposing surface of the semiconductor.

公开(公告)号：US20220285577A1

公开(公告)日：2022-09-08

申请号：US17649018

申请日：2022-01-26

Applicant: Apple Inc.

Inventor： Lei Zhang ,  Fang Ou ,  Lina He ,  Paul S. Drzaic ,  Dmitry S. Sizov ,  Ranojoy Bose ,  Yuewei Zhang ,  Xiaobin Xin ,  Nathaniel T. Lawrence ,  Wei H. Yao

IPC: H01L33/00 ,  H01L25/16

Abstract: Methods and structures are described to facilitate the transfer of device layer coupons with controlled vertical position. In an embodiment, a plurality of device layer coupons is bonded to a receiving substrate with an adhesive layer, where distance between front surfaces of the plurality of device layer coupons and a bulk layer of the receiving substrate is controlled by a plurality of rigid mechanical spacers.

公开(公告)号：US20200343230A1

公开(公告)日：2020-10-29

申请号：US16960480

申请日：2019-01-22

Applicant: Apple Inc.

Inventor： Dmitry S. Sizov ,  Ion Bita ,  Jean-Jacques P. Drolet ,  John T. Leonard ,  Jonathan S. Steckel ,  Nathaniel T. Lawrence ,  Xiaobin Xin ,  Ranojoy Bose

IPC: H01L25/075 ,  H01L25/18 ,  H01L33/60 ,  H01L25/16 ,  H01L23/00

Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.