公开(公告)号：US20250095968A1

公开(公告)日：2025-03-20

申请号：US18370132

申请日：2023-09-19

Applicant: Applied Materials, Inc.

Inventor： Laksheswar Kalita ,  Nitin K. Ingle ,  Nilesh Mistry ,  Jonathan J. Strahle ,  Christopher L. Beaudry ,  Lok Kee Loh

IPC: H01J37/32

Abstract: Exemplary methods for a coating a component of a semiconductor processing system may include forming a nickel-containing alloy on an exposed surface the component of the semiconductor processing system. The methods may include forming plasma effluents of a fluorine-containing precursor. The methods may include contacting the nickel-containing alloy with the plasma effluents of the fluorine-containing precursor. The contacting may fluorinate a portion of the nickel-containing alloy to form a nickel-and-fluorine-containing material overlying the nickel-containing alloy.