公开(公告)号：US20180084610A1

公开(公告)日：2018-03-22

申请号：US15824489

申请日：2017-11-28

Applicant: Applied Materials, Inc.

Inventor： Kin Pong LO ,  Paul BRILLHART ,  Ramachandran BALASUBRAMANIAN ,  Satheesh KUPPURAO ,  Daniel REDFIELD ,  Joseph M. RANISH ,  James Francis MACK ,  Kailash Kiran PATALAY ,  Michael OLSEN ,  Eddie FEIGEL ,  Richard HALPIN ,  Brett VETORINO

IPC: H05B3/00 ,  H01L21/67

CPC classification number: H05B3/0047 ,  H01L21/67115

Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.