公开(公告)号：US20210149308A1

公开(公告)日：2021-05-20

申请号：US17157634

申请日：2021-01-25

Applicant: Applied Materials, Inc.

Inventor： Benjamin M. JOHNSTON ,  Preston FUNG ,  Sean SCREWS ,  Cheuk Ming LEE ,  Jae Myung YOO

IPC: G03F7/20

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.