公开(公告)号：US20240141478A1

公开(公告)日：2024-05-02

申请号：US18498239

申请日：2023-10-31

Applicant: Applied Materials, Inc.

Inventor： Timothy KLEINER ,  David Masayuki Ishikawa ,  Kenneth Moyers ,  Sumedh Dattatraya Acharya ,  Visweswaren Sivaramakrishnan

IPC: C23C14/54 ,  C23C14/24 ,  C23C14/56 ,  H01M4/04 ,  H01M4/1395

CPC classification number: C23C14/541 ,  C23C14/24 ,  C23C14/562 ,  H01M4/0423 ,  H01M4/1395

Abstract: The present disclosure relates to vapor deposition systems and methods. In one embodiment, a drum for vapor deposition is provided. The drum includes a shell having gas slits and a cooling drum. The cooling drum includes an exterior region, an interior region, a first fluid channel partially defined by the exterior region and the interior region, and a first inlet. The first fluid channel forms a helical channel around a central axis of the cooling drum. The first inlet is in fluid communication with a first outlet by the first fluid channel.