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    PREDICTION OF ELECTRICAL PROPERTIES OF A SEMICONDUCTOR SPECIMEN
    1.
    发明申请
    PREDICTION OF ELECTRICAL PROPERTIES OF A SEMICONDUCTOR SPECIMEN 有权

    公开(公告)号：US20220210525A1

    公开(公告)日：2022-06-30

    申请号：US17134025

    申请日：2020-12-24

    Applicant: Applied Materials Israel Ltd.

    Inventor： Ofer ADAN

    IPC: H04Q9/00 ,  G01R31/26 ,  G06F30/333

    Abstract: There is provided a method and a system configured to obtain metrology data Dmetrology informative of a plurality of structural parameters of a semiconductor specimen, obtain a model informative of a relationship between at least some of said structural parameters and one or more electrical properties of the specimen, use the model and Dmetrology to determine, for at least one given electrical property of the specimen, one or more given structural parameters among the plurality of structural parameters, which affect the given electrical property according to an impact criterion, and generate a recipe for an examination tool, wherein the recipe enables a ratio between a first acquisition rate of data informative of the one or more given structural parameters, and a second acquisition rate of data informative of other structural parameters of the plurality of structural parameters, to meet a criterion.

    TECHNIQUE FOR MEASURING OVERLAY BETWEEN LAYERS OF A MULTILAYER STRUCTURE
    4.
    发明申请
    TECHNIQUE FOR MEASURING OVERLAY BETWEEN LAYERS OF A MULTILAYER STRUCTURE 有权
    用于测量多层结构层之间的覆盖的技术

    公开(公告)号：US20170018066A1

    公开(公告)日：2017-01-19

    申请号：US14798283

    申请日：2015-07-13

    Applicant: Applied Materials Israel Ltd.

    Inventor： Yakov WEINBERG ,  Ishai SCHWARZBAND ,  Roman KRIS ,  Itay ZAUER ,  Ran GOLDMAN ,  Olga NOVAK ,  Dhananjay Singh RATHORE ,  Ofer ADAN ,  Shimon LEVI

    IPC: G06T7/00

    CPC classification number: G06T7/0006 ,  G06K9/525 ,  G06T7/001 ,  G06T7/10 ,  G06T7/11 ,  G06T7/12 ,  G06T7/143 ,  G06T7/194 ,  G06T7/30 ,  G06T7/337 ,  G06T2207/10061 ,  G06T2207/20116 ,  G06T2207/30148

    Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

    Abstract translation: 用于确定多层结构的层之间的重叠的方法可以包括获得表示多层结构的给定图像，获得多层结构层的预期图像，提供多层结构的组合预期图像作为所述多层结构的预期图像的组合 执行给定图像对组合预期图像的注册，以及提供给定图像的分割，从而产生分割图像，以及所述多层结构层的映射。 该方法还可以包括通过将所选择的两个层的图与所述两个所选择的层的预期图像一起处理来确定多层结构的任何两个所选择的层之间的覆盖。

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