公开(公告)号：US20140158185A1

公开(公告)日：2014-06-12

申请号：US14119016

申请日：2012-08-30

Applicant: Arkema Inc.

Inventor： Amy A. Lefebvre ,  Gregory S. O'brien ,  Samuel Devisme ,  Anthony Bonnet

IPC: H01L31/048

CPC classification number: H01L31/048 ,  B32B5/022 ,  B32B5/024 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/304 ,  B32B27/32 ,  B32B27/34 ,  B32B2307/712 ,  B32B2457/12 ,  H01L31/049 ,  Y02E10/50

Abstract: The invention relates to a multi-layer weatherable film structure having an outer layer of a highly weatherable film, a layer having a high thermal deformation temperature, an optional tie layer, and a thin layer of polyolefin or polyamide. The highly weatherable film layer preferably is polyvinylidene fluoride. The polyolefin or polyamide layer is less than 500 microns in thickness, and preferably the whole film structure is less than 750 microns thick. The polyolefinjpolyamide side of the film structure can easily be adhered to many different substances—especially polyolefins and polyamides. This film can be used to provide a highly weatherable protective layer a substrate. One useful application for the film is in a photovoltaic module to protect the back side of the module from weathering and abrasion. The multi-layer film structure can be adhered to a typical polyolefin-based encapsulant layer and used as a backsheet encapsulant in a photovoltaic module.

Abstract translation: 本发明涉及一种多层耐候性薄膜结构，其具有高耐候性薄膜的外层，具有高热变形温度的层，可选的粘结层和聚烯烃或聚酰胺的薄层。 高耐候性薄膜层优选为聚偏二氟乙烯。 聚烯烃或聚酰胺层的厚度小于500微米，优选整个薄膜结构小于750微米厚。 膜结构的聚烯烃聚酰胺侧可以容易地粘附到许多不同的物质，特别是聚烯烃和聚酰胺。 该膜可用于提供高耐候性保护层的基材。 该膜的一个有用的应用是在光伏模块中，以保护模块的背面免受风化和磨损。 多层膜结构可以粘附到典型的聚烯烃基密封剂层并用作光伏模块中的底片密封剂。