公开(公告)号：US20210166934A1

公开(公告)日：2021-06-03

申请号：US17044928

申请日：2019-04-02

Applicant: BASF SE

Inventor： Andreas KLIPP ,  Christian BITTNER ,  Simon BRAUN ,  Guenter OETTER ,  Yeni BURK

IPC: H01L21/02 ,  C07C271/12

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.