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公开(公告)号：US20210198602A1
公开(公告)日：2021-07-01
申请号：US17057801
申请日：2019-05-13
Applicant: BASF SE
Inventor： Marcel BRILL , Daniel LOEFFLER , Yeni BURK , Frank PIRRUNG , Lothar ENGELBRECHT , Szilard CSIHONY , Maike BERGELER , Volodymyr BOYKO , Patrick WILKE
Abstract: The invention relates to the use of a composition comprising a C1 to C6 alkanol and a carboxylic acid ester of formula (I) wherein R1 is selected from a C1 to C6 alkyl, which may be unsubstituted or substituted by OH or F, and —X21—[O—X22]n—H; R2 is selected from a C1 to C6 alkyl, which may be unsubstituted or substituted by OH or F, and —X21—[O—X22]n—H; X21, X22 are independently selected from C1 to C6 alkandiyl, which may be unsubstituted or substituted by OH or F; n is an integer from 1 to 5. wherein, the C1 to C6 alkanol and the carboxylic acid ester are selected so as to form an azeotropic mixture and are present in an amount from 20% by weight below to 20% by weight above such azeotropic mixture.
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Patent Agency Ranking
公开(公告)号：US20200255772A1
公开(公告)日：2020-08-13
申请号：US16756303
申请日：2018-10-29
Applicant: BASF SE
Inventor： Daniel LOEFFLER , Mei Chin SHEN , Sheng Hsuan WEI , Frank PIRRUNG , Lothar ENGELBRECHT , Yeni BURK , Andreas KLIPP , Marcel BRILL , Szilard CSIHONY
Abstract: The invention relates to the use of a non-aqueous composition comprising an organic solvent and at least one particular siloxane-type additive for treating substrates comprising patterns having line-space dimensions of 50 nm or below and aspect ratios of 4 or more as well as a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm, aspect ratios of greater or equal 4, or a combination thereof, (2) contacting the substrate at least once with a non-aqueous composition, and (3) removing the non-aqueous composition from the contact with the substrate, wherein the non-aqueous composition comprising an organic solvent and at least one of such siloxane-type additives.
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公开(公告)号：US20220324885A1
公开(公告)日：2022-10-13
申请号：US17626836
申请日：2020-07-03
Applicant: BASF SE
Inventor： Szilard CSIHONY , Jean-Pierre Berkan LINDNER , Daniel LOEFFLER , Yeni BURK , Ingolf HENNIG , Lucas Benjamin HENDERSON , Birgit GERKE , Rui DE OLIVEIRA , Volodymyr BOYKO , Frank PIRRUNG
Abstract: A composition comprising a monomer of the general formula (M1) wherein M is a metal or semimetal of main group 3 or 4 of the periodic table; XM1, XM2 are each O; RM1, RM2 are the same or different and are each an —CRaRb—Ar—O—Rc; Ar is a C6 to C30 carbocyclic ring system; Ra, Rb are the same or different and are each H or C1 to C6 alkyl; Rc is C1-C22-alkyl, benzyl or phenyl; q according to the valency and charge of M is 0 or 1; XM3, XM4 are the same or different and are each O, C6 to C10 aryl, or —CH2—; RM3, RM4 are the same or different and are each RM1, H, C1-C22 alkyl, or a polymer selected from a polyalkylene, a polysiloxane, or a polyether.
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公开(公告)号：US20210395513A1
公开(公告)日：2021-12-23
申请号：US17281230
申请日：2019-09-26
Applicant: BASF SE
Inventor： Jean-Pierre Berkan LINDNER , Szilard CSIHONY , Daniel LOEFFLER , Yeni BURK , Birgit GERKE , Frank PIRRUNG , Lucas Benjamin HENDERSON , Volodymyr BOYKO , Rui DE OLIVEIRA , Ingolf HENNIG , Miran YU
Abstract: A resin composition, comprising (a) at least one epoxy resin, and (b) at least one siloxane-type curing agent of formula C22 or C31 (C22) (C31) wherein the resin composition does essentially not contain any fluoride or bromide.
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公开(公告)号：US20210166934A1
公开(公告)日：2021-06-03
申请号：US17044928
申请日：2019-04-02
Applicant: BASF SE
Inventor： Andreas KLIPP , Christian BITTNER , Simon BRAUN , Guenter OETTER , Yeni BURK
IPC: H01L21/02 , C07C271/12
Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.
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公开(公告)号：US20170226377A1
公开(公告)日：2017-08-10
申请号：US15500821
申请日：2015-07-29
Applicant: BASF SE
Inventor： Ekkehard JAHNS , Timo MANGEL , Christine ROESCH , Paola ROMANATO , Yeni BURK , Joachim PAKUSCH
IPC: C09D175/08 , C09D7/12 , C08G18/72 , E04D7/00 , C08G18/32 , C08G18/66 , C08F283/00 , C08K3/00 , C08G18/40
CPC classification number: C09D175/08 , C08F2/16 , C08F283/006 , C08G18/0828 , C08G18/0866 , C08G18/12 , C08G18/227 , C08G18/246 , C08G18/283 , C08G18/3206 , C08G18/4018 , C08G18/4238 , C08G18/6607 , C08G18/6674 , C08G18/722 , C08G18/755 , C08G18/758 , C08K3/00 , C08K5/42 , C09D7/61 , C09D175/06 , E04D7/00 , C08G18/3857 , C08G18/3228 , C08G18/3234 , C08K3/013
Abstract: The present invention provides an aqueous polyurethane (PU)-polyacrylate hybrid dispersion obtainable by free radical polymerization of at least one acrylate polymer (A1) in the presence of at least one polyurethane (P1), a process for preparing these aqueous polyurethane-polyacrylate hybrid dispersions, wherein said process comprises a) preparing an aqueous polyurethane dispersion and b) using the polyurethane dispersion thus prepared as raw material for the further synthesis of a polyacrylate dispersion, and the use of the hybrid dispersion thus obtained as binder in filled coating materials, particularly as a binder for flexible roof coatings.
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