公开(公告)号：US20230269879A1

公开(公告)日：2023-08-24

申请号：US18003866

申请日：2021-06-28

Applicant: BYD COMPANY LIMITED

Inventor： Wei ZHOU ,  Qiang XU ,  Caicai XIE

IPC: H05K3/02 ,  H05K3/38 ,  H05K1/03 ,  C04B37/02

CPC classification number: H05K3/022 ,  C04B37/023 ,  H05K1/0306 ,  H05K3/385 ,  C04B2237/122 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/525 ,  C23C22/52 ,  H05K2203/0786 ,  H05K2203/1105

Abstract: A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.