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    Relating to printing
    6.
    发明授权
    Relating to printing 有权
    关于打印

    公开(公告)号：US09586392B2

    公开(公告)日：2017-03-07

    申请号：US13063465

    申请日：2009-09-07

    申请人： John David Adamson ,  Peter Andrew Reath Bennett ,  Rodney Martin Potts

    发明人： John David Adamson ,  Peter Andrew Reath Bennett ,  Rodney Martin Potts

    IPC分类号： B41C1/10 ,  B41N1/08 ,  B41M1/06 ,  B41N1/00 ,  G03F7/004 ,  H05K3/12 ,  H05K3/38

    CPC分类号： B41C1/1041 ,  B41M1/06 ,  B41N1/006 ,  B41N1/083 ,  G03F7/0043 ,  H05K3/1275 ,  H05K3/385 ,  H05K2203/0315

    摘要： A method of preparing a printing form precursor for printing, or a printed circuit board precursor or a semiconductor precursor, the method comprising the step of applying electromagnetic radiation having a pulse duration of not greater than 1×10−6 seconds, in an imagewise manner, to an imagable surface of the precursor. The imaging process may cause ablation of the coating of the precursor or permit its development in a developer. In each case the imaging radiation needs not be tuned to imaging chemistry (if any) present in the coating. Alternatively the imaging process may induce a change of hydrophilicity or hydrophobicity, or other change of state, of an uncoated substrate.

    摘要翻译： 一种制备用于印刷的印刷版前体的方法或印刷电路板前体或半导体前体，所述方法包括以成像方式施加脉冲持续时间不超过1×10-6秒的电磁辐射的步骤 ，到前体的可成像表面。 成像过程可能导致前体涂层的消融或允许其在显影剂中显影。 在每种情况下，成像辐射不需要调整到涂层中存在的成像化学（如果有的话）。 或者，成像过程可以引起未涂覆的底物的亲水性或疏水性或其它状态变化。

    Method of printing using a reimageable printing plate with an aluminum oxide surface
    7.
    发明授权
    Method of printing using a reimageable printing plate with an aluminum oxide surface 有权
    使用具有氧化铝表面的可再成像印版进行印刷的方法

    公开(公告)号：US09545785B2

    公开(公告)日：2017-01-17

    申请号：US13063466

    申请日：2009-09-07

    申请人： John David Adamson ,  Peter Andrew Reath Bennett ,  Richard Arthur Hutchinson ,  Rodney Martin Potts

    发明人： John David Adamson ,  Peter Andrew Reath Bennett ,  Richard Arthur Hutchinson ,  Rodney Martin Potts

    IPC分类号： B41C1/10 ,  B41M1/06 ,  B41N1/00 ,  G03F7/004 ,  H05K3/12 ,  H05K3/38

    CPC分类号： B41C1/1041 ,  B41M1/06 ,  B41N1/006 ,  B41N1/083 ,  G03F7/0043 ,  H05K3/1275 ,  H05K3/385 ,  H05K2203/0315

    摘要： A printing form precursor comprises a printing surface which comprises an inorganic metal compound, the printing surface being hydrophobic and capable of being made hydrophilic by energy but capable of becoming hydrophobic again, for reuse, if desired. An associated method of printing includes steps of subjecting the printing surface imagewise to energy so as to locally increase its hydrophilicity sufficient to make the surface differentiated in its acceptance of an oleophilic a printing ink; applying the ink to the printing surface and printing from the printing surface; causing or allowing the printing surface to undergo a reduction in hydrophilicity sufficient again to make the printing surface uniform in its acceptance of a printing ink; and, if wished, repeating these steps on multiple occasions. Thus the invention achieves the goal of providing a printing form precursor which does not need a chemical developer, and which can be used multiple times, to print different images.

    摘要翻译： 印刷版前体包括印刷表面，其包含无机金属化合物，印刷表面是疏水性的，并且能够通过能量制成亲水性，但是能够再次变得疏水，如果需要可再利用。 相关联的印刷方法包括以下步骤：使印刷表面成像地进行能量，以便局部地增加其亲水性，足以使表面在接受亲油性印刷油墨方面不同; 将油墨施加到印刷表面并从印刷表面印刷; 导致或允许印刷表面再次充分地进行亲水性的降低，以使印刷表面在其接受印刷油墨方面均匀; 如果愿意多次重复这些步骤。 因此，本发明实现了提供不需要化学显影剂并且可以多次使用的印刷形式前体来打印不同图像的目标。

    Adhesion Promotion in Printed Circuit Boards
    8.
    发明申请
    Adhesion Promotion in Printed Circuit Boards 审中-公开
    印刷电路板粘合促进

    公开(公告)号：US20160234947A1

    公开(公告)日：2016-08-11

    申请号：US15134701

    申请日：2016-04-21

    申请人： Enthone, Inc.

    发明人： Abayomi I. Owei ,  Joseph A. Abys ,  Theodore Antonellis ,  Eric Walch

    IPC分类号： H05K3/38

    CPC分类号： H05K3/385 ,  B05D3/10 ,  B05D5/10 ,  C23C22/52 ,  C23C22/63 ,  C23C22/73 ,  C23C22/78 ,  C23F1/18 ,  C23G1/20 ,  H05K3/383

    摘要： Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.

    摘要翻译： 用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。 调理组合物含有功能性有机化合物，优选过渡金属离子。 功能性有机化合物，例如嘌呤衍生物，能够形成自组装单层。 粘合促进组合物含有酸，优选无机酸和氧化剂。 后一种组合物还可以含有选自Zn，Ni，Co，Cu，Ag，Au，Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。 腐蚀抑制剂可以包含含氮芳族杂环化合物。

    Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards
    9.
    发明授权
    Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards 有权
    处理铜表面以增强对用于印刷电路板的有机基板的粘附性的方法

    公开(公告)号：US09345149B2

    公开(公告)日：2016-05-17

    申请号：US13142588

    申请日：2010-07-06

    申请人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    发明人： Jen-Chieh Wei ,  Zhiming Liu ,  Steven Z. Shi ,  Werner G. Kuhr

    IPC分类号： B32B38/08 ,  B05D5/12 ,  B32B37/14 ,  B05D3/10 ,  H05K3/38 ,  H05K3/46

    CPC分类号： H05K3/385 ,  H05K1/09 ,  H05K3/389 ,  H05K3/4652 ,  H05K2203/1157 ,  Y10T156/10

    摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

    摘要翻译： 本发明的实施例一般涉及印刷电路板（PCB）或印刷电路板（PWB）的制造，特别涉及用于处理光滑的铜表面以增加铜表面和有机基底之间的粘附性的方法。 更具体地，本发明的实施例涉及在不使铜表面形貌粗糙化的情况下实现PCB的粘合强度的改善的方法。 经处理的铜和PCB的树脂层之间的结合界面显示出优异的耐热性，湿气性和在层压后工艺步骤中涉及的化学物质。