Thermal treatment of silicon wafers useful for photovoltaic applications
    2.
    发明授权
    Thermal treatment of silicon wafers useful for photovoltaic applications 有权
    用于光伏应用的硅晶片的热处理

    公开(公告)号:US09105786B2

    公开(公告)日:2015-08-11

    申请号:US13446450

    申请日:2012-04-13

    申请人: John P. Deluca

    发明人: John P. Deluca

    摘要: Efficiency of silicon photovoltaic solar cells is increased by an annealing process for immobilizing oxygen formed in Czochralski-grown silicon. The annealing process includes a short anneal in a rapid thermal annealing chamber at a high temperature, for example, greater than 1150° C. in an oxygen-containing ambient. More preferably, the wafer is rapidly cooled to less than 950° C. without an intermediate temperature hold, at which temperature oxygen does not nucleate and/or precipitate. Subsequent processing to form a photovoltaic structure is typically performed at relatively low temperatures of less than 1000° C. or even 875° C.

    摘要翻译: 通过用于固定在Czochralski生长的硅中形成的氧的退火工艺来提高硅光伏太阳能电池的效率。 退火过程包括在快速热退火室中在含氧环境中的高温例如大于1150℃的短退火。 更优选地,将晶片快速冷却至小于950℃,而不需要中间温度保持,在该温度下,氧不会成核和/或沉淀。 形成光伏结构的后续处理通常在小于1000℃或甚至875℃的较低温度下进行。