公开(公告)号：US20110286191A1

公开(公告)日：2011-11-24

申请号：US12926337

申请日：2010-11-10

申请人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

发明人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

IPC分类号： H05K7/06

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。

公开(公告)号：US08253034B2

公开(公告)日：2012-08-28

申请号：US12926337

申请日：2010-11-10

申请人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

发明人： Byoung Chan Kim ,  Young Hwan Shin ,  Chin Kwan Kim ,  Dong Won Kim ,  Kui Won Kang

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K7/10

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein is a printed circuit board. The printed circuit board includes a base substrate including a first region on which a semiconductor chip is mounted and a second region positioned outside the first region, first insulating patterns covering the base substrate and including trenches formed on the second region, and second insulating patterns protruding from the first insulating patterns on the second region. The trench and the second insulating pattern may be used as a structure defining an underfill forming material in a preset shape during the process of forming an underfill.

摘要翻译： 这里公开了一种印刷电路板。 印刷电路板包括：基底基板，其包括安装有半导体芯片的第一区域和位于第一区域外部的第二区域;覆盖基底基板并且包括形成在第二区域上的沟槽的第一绝缘图案，以及第二绝缘图案突出 从第二区域上的第一绝缘图案。 在形成底部填充剂的过程中，沟槽和第二绝缘图案可以用作限定形成预处理形状的底部填充材料的结构。