公开(公告)号：US11894473B2

公开(公告)日：2024-02-06

申请号：US17363305

申请日：2021-09-09

Applicant: CHIP POSITION SYSTEM CO., LTD.

Inventor： Ruei Chi Chen ,  Chih Lin Yang

IPC: H01L31/0232 ,  B81C1/00 ,  B81B7/00

CPC classification number: H01L31/02322 ,  B81B7/0077 ,  B81C1/00269 ,  H01L31/02325 ,  B81B2201/0285 ,  B81B2201/0292 ,  B81C2203/0109 ,  B81C2203/032

Abstract: The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.