公开(公告)号：US11604755B2

公开(公告)日：2023-03-14

申请号：US17196124

申请日：2021-03-09

Applicant: Cisco Technology, Inc.

Inventor： Jayaprakash Balachandran ,  Bidyut Kanti Sen ,  Kenny Lieu ,  Dattatri N. Mattur

IPC: G06F13/40 ,  G06F3/12 ,  H05K7/10

Abstract: Presented herein are improvement to computer system architecture. In one embodiment, a method includes reconfiguring system interconnect links disposed between a first central processing unit socket and a second central processing unit socket, disposed together on a single motherboard, as peripheral bus links; and transmitting electrical signals, via the peripheral bus links, and via a printed circuit board that bridges the second central processing unit socket, to at least one input/output functional block that is disposed on the single motherboard and that is selectively connectable to the second central processing unit socket.

公开(公告)号：US20240427088A1

公开(公告)日：2024-12-26

申请号：US18828247

申请日：2024-09-09

Applicant: Cisco Technology, Inc.

Inventor： Anant Thakar ,  Bidyut Kanti Sen ,  Jayaprakash Balachandran ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: G02B6/38 ,  G02B6/42 ,  H01R12/59 ,  H05K5/02

Abstract: A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

公开(公告)号：US12158616B2

公开(公告)日：2024-12-03

申请号：US17547789

申请日：2021-12-10

Applicant: Cisco Technology, Inc.

Inventor： Anant Thakar ,  Bidyut Kanti Sen ,  Jayaprakash Balachandran ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: H01R12/59 ,  G02B6/38 ,  G02B6/42 ,  H05K5/02

Abstract: A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

公开(公告)号：US20230185029A1

公开(公告)日：2023-06-15

申请号：US17547789

申请日：2021-12-10

Applicant: Cisco Technology, Inc.

Inventor： Anant Thakar ,  Bidyut Kanti Sen ,  Jayaprakash Balachandran ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: G02B6/38 ,  H05K5/02 ,  H01R12/59 ,  G02B6/42

CPC classification number: G02B6/3817 ,  H05K5/0286 ,  H01R12/598 ,  G02B6/4292

Abstract: A composite connector includes modular data connectors, electrical power connectors, a fluid exchange connector, an alignment feature, and a housing. The modular data connectors include electrical data connectors and optical data connectors and are configured to carry data. The electrical power connectors are configured to carry electrical power, and the fluid exchange connector is configured to carry cooling fluid. The composite connector includes an alignment feature to align the composite connector with a complementary connector. The housing of the composite connector is configured to contain the modular data connectors, the electrical power connectors, the fluid exchange connector, and the alignment feature in a confined physical space.

公开(公告)号：US20180019953A1

公开(公告)日：2018-01-18

申请号：US15210722

申请日：2016-07-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Victor Odisho ,  Bidyut Kanti Sen ,  Jayaprakash Balachandran ,  Michael Leung

IPC: H04L12/927 ,  H04L29/08

CPC classification number: H04L67/2842 ,  H04L67/1095

Abstract: An embodiment includes a first server including a first processor electrically connected to a second processor; a second server including a third processor electrically connected to a fourth processor; a first connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a first connection via the first connection plane and one of the first and second processors is connected to one of the third and fourth processors by a second connection via the first connection plane; and a second connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a third connection via the second connection plane and wherein one of the first and second processors is connected to one of the third and fourth processors by a fourth connection via the second connection plane.

公开(公告)号：US20220292041A1

公开(公告)日：2022-09-15

申请号：US17196124

申请日：2021-03-09

Applicant: Cisco Technology, Inc.

Inventor： Jayaprakash Balachandran ,  Bidyut Kanti Sen ,  Kenny Lieu ,  Dattatri N. Mattur

IPC: G06F13/40 ,  H05K7/10

Abstract: Presented herein are improvement to computer system architecture. In one embodiment, a method includes reconfiguring system interconnect links disposed between a first central processing unit socket and a second central processing unit socket, disposed together on a single motherboard, as peripheral bus links; and transmitting electrical signals, via the peripheral bus links, and via a printed circuit board that bridges the second central processing unit socket, to at least one input/output functional block that is disposed on the single motherboard and that is selectively connectable to the second central processing unit socket.

公开(公告)号：US20190075158A1

公开(公告)日：2019-03-07

申请号：US15697012

申请日：2017-09-06

Applicant: Cisco Technology, Inc.

Inventor： Yang Sun ,  Jayaprakash Balachandran ,  Rudong Shi ,  Bidyut Kanti Sen

IPC: H04L29/08 ,  G06F3/06

Abstract: A network interface controller configured to be hosted by a first server, includes: a first input/output (IO) port configured to be coupled to a network switch; a second IO port configured to be coupled to a corresponding IO port of a second network interface controller of a second server; and a third IO port configured to be coupled to a corresponding IO port of a third network interface controller of a third server.