公开(公告)号：US20180019953A1

公开(公告)日：2018-01-18

申请号：US15210722

申请日：2016-07-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Victor Odisho ,  Bidyut Kanti Sen ,  Jayaprakash Balachandran ,  Michael Leung

IPC: H04L12/927 ,  H04L29/08

CPC classification number: H04L67/2842 ,  H04L67/1095

Abstract: An embodiment includes a first server including a first processor electrically connected to a second processor; a second server including a third processor electrically connected to a fourth processor; a first connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a first connection via the first connection plane and one of the first and second processors is connected to one of the third and fourth processors by a second connection via the first connection plane; and a second connection plane, wherein one of the first and second processors is connected to one of the third and fourth processors by a third connection via the second connection plane and wherein one of the first and second processors is connected to one of the third and fourth processors by a fourth connection via the second connection plane.