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1.
公开(公告)号:US20150304053A1
公开(公告)日:2015-10-22
申请号:US14255107
申请日:2014-04-17
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Stefan Pfnuer , Pangchen Sun , Matt Traverso , Ravinder Kachru
IPC: H04B10/60
CPC classification number: G02B6/428 , G02B6/4214 , G02B6/4215 , G02B6/4248 , G02B6/4257 , H04B10/2504
Abstract: An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.
Abstract translation: 为光收发器的光接收部件提供光学组件封装。 光学组件封装包括构造成接收光纤端部的插座子组件。 提供了一个壳体,其一端具有一开口,构造成容纳该插座组件。 光路由和波长解复用元件安装到壳体的底壁。 一种电气子组件,包括支撑板,安装在支撑板上的电路板,安装到电路板的集成电路以及安装到靠近电路板边缘的支撑板的多个光电检测器。 电子组件被定位在壳体下面的堆叠布置以最小化光学组件封装的总长度。
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2.
公开(公告)号:US09476763B2
公开(公告)日:2016-10-25
申请号:US14155927
申请日:2014-01-15
Applicant: Cisco Technology, Inc.
Inventor: Ravinder Kachru , Stefan Martin Pfnuer , Pangchen Sun
IPC: G01J1/04
CPC classification number: G01J1/0425 , G02B6/12019 , G02B6/4207 , G02B6/4214 , G02B6/4274 , H01L2224/48091 , H01L2224/73265 , Y10T29/41 , H01L2924/00014
Abstract: An apparatus is provided in which a photodiode supported on a planar light wave circuit assembly and arranged such that a photosensitive portion of the photodiode is aligned along an optical path from the output of the planar light wave circuit to the photodiode of the planar light wave circuit assembly. The photodiode is arranged such that a spot size of light output from the planar light wave circuit is incident on the photosensitive portion such that an optical signal transmitted by the light output is converted to an electric signal by the photodiode. A mounting structure is arranged between the planar light wave circuit assembly and the photodiode in order to support the photodiode on the planar light wave circuit assembly. The optical path of the light output from the planar light wave circuit does not contain any refractive optical elements.
Abstract translation: 提供一种装置,其中支撑在平面光波电路组件上的光电二极管被布置成使得光电二极管的感光部分沿着从平面光波电路的输出到平面光波电路的光电二极管的光路对准 部件。 光电二极管被布置成使得从平面光波电路输出的光的光斑尺寸入射到感光部分上,使得由光输出传输的光信号被光电二极管转换成电信号。 在平面光波电路组件和光电二极管之间设置安装结构,以便在平面光波电路组件上支撑光电二极管。 从平面光波电路输出的光的光路不包含任何折射光学元件。
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3.
公开(公告)号:US09417413B2
公开(公告)日:2016-08-16
申请号:US14255107
申请日:2014-04-17
Applicant: Cisco Technology, Inc.
Inventor: Stefan Pfnuer , Pangchen Sun , Matt Traverso , Ravinder Kachru
CPC classification number: G02B6/428 , G02B6/4214 , G02B6/4215 , G02B6/4248 , G02B6/4257 , H04B10/2504
Abstract: An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.
Abstract translation: 为光收发器的光接收部件提供光学组件封装。 光学组件封装包括构造成接收光纤端部的插座子组件。 提供了一个壳体,其一端具有一开口,构造成容纳该插座组件。 光路由和波长解复用元件安装到壳体的底壁。 一种电气子组件,包括支撑板,安装在支撑板上的电路板,安装到电路板的集成电路以及安装到靠近电路板边缘的支撑板的多个光电检测器。 电子组件被定位在壳体下面的堆叠布置以最小化光学组件封装的总长度。
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4.
公开(公告)号:US20150198478A1
公开(公告)日:2015-07-16
申请号:US14155927
申请日:2014-01-15
Applicant: Cisco Technology, Inc.
Inventor: Ravinder Kachru , Stefan Martin Pfnuer , Pangchen Sun
IPC: G01J1/04
CPC classification number: G01J1/0425 , G02B6/12019 , G02B6/4207 , G02B6/4214 , G02B6/4274 , H01L2224/48091 , H01L2224/73265 , Y10T29/41 , H01L2924/00014
Abstract: An apparatus is provided in which a photodiode supported on a planar light wave circuit assembly and arranged such that a photosensitive portion of the photodiode is aligned along an optical path from the output of the planar light wave circuit to the photodiode of the planar light wave circuit assembly. The photodiode is arranged such that a spot size of light output from the planar light wave circuit is incident on the photosensitive portion such that an optical signal transmitted by the light output is converted to an electric signal by the photodiode. A mounting structure is arranged between the planar light wave circuit assembly and the photodiode in order to support the photodiode on the planar light wave circuit assembly. The optical path of the light output from the planar light wave circuit does not contain any refractive optical elements.
Abstract translation: 提供一种装置,其中支撑在平面光波电路组件上的光电二极管被布置成使得光电二极管的感光部分沿着从平面光波电路的输出到平面光波电路的光电二极管的光路对准 部件。 光电二极管被布置成使得从平面光波电路输出的光的光斑尺寸入射到感光部分上,使得由光输出传输的光信号被光电二极管转换成电信号。 在平面光波电路组件和光电二极管之间设置安装结构,以便在平面光波电路组件上支撑光电二极管。 从平面光波形电路输出的光的光路不包含任何折射光学元件。
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