Optical probe package structure
    2.
    发明授权

    公开(公告)号:US11947172B2

    公开(公告)日:2024-04-02

    申请号:US17862442

    申请日:2022-07-12

    IPC分类号: G02B6/42 G01M11/00

    摘要: An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.

    Optical components assembly
    8.
    发明授权

    公开(公告)号:US09851516B2

    公开(公告)日:2017-12-26

    申请号:US14926250

    申请日:2015-10-29

    IPC分类号: G02B6/42

    摘要: A system, optical assembly, and optical communication system are disclosed. The optical assembly is disclosed as including an optoelectronic component having a predetermined shape and an optical module that permits light emitted by the optoelectronic component or travelling to the optoelectronic component to pass therethough. The optical module is further disclosed as including a first surface and an opposing second surface, the first surface of the optical module including a first mating feature to receive the optoelectronic component, and the second surface of the optical module including a receptacle to receive and align an optical fiber with the optoelectronic component.