公开(公告)号：US20200001576A1

公开(公告)日：2020-01-02

申请号：US16456291

申请日：2019-06-28

Applicant: CORNING INCORPORATED

Inventor： Thomas Michael Cleary ,  Andrew Peter Kittleson ,  Yousef Kayed Qaroush ,  Thomas M. Tremper ,  Bo Yang

IPC: B32B17/10 ,  B60J1/00

Abstract: Principles and embodiments of the present disclosure relate to unique asymmetric laminates and methods that produce the laminates where the laminate includes an first glass substrate having a first thickness (to), an second glass substrate having a second thickness (ti), an interlayer disposed between the second glass substrate and the first glass substrate, wherein the first thickness and the second thickness has a combined third thickness (tt), and wherein to/tt or ti/tt is in a range from about 0.7 to about 0.99.

公开(公告)号：US20230393310A1

公开(公告)日：2023-12-07

申请号：US18033152

申请日：2021-10-07

Applicant: CORNING INCORPORATED

Inventor： Naigeng Chen ,  Stephan Lvovich Logunov ,  Weiwei Luo ,  Mark Alejandro Quesada ,  Bo Yang

IPC: G02B3/14 ,  B23K26/57 ,  B23K26/324 ,  G02B26/00 ,  B23K31/12

CPC classification number: G02B3/14 ,  B23K26/57 ,  B23K2103/54 ,  G02B26/005 ,  B23K31/12 ,  B23K26/324

Abstract: A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of the bonds has a strength, and the strength of the bonds increases sequentially from the innermost bond to the outermost bond. The strength of each bond is sufficiently low such that the bonds fail in response to liquid (within a cavity defined by the first substrate, a third substrate, and the through-hole of the second substrate) exerting pressure on the first substrate instead of the first substrate failing. Each of the bonds are configured to fail at approximately the same pressure exerted upon the first substrate by the liquid. Additionally disclosed is a method of manufacturing the device.