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    Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same
    6.
    发明授权
    Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same 有权

    公开(公告)号：US11422310B2

    公开(公告)日：2022-08-23

    申请号：US16877859

    申请日：2020-05-19

    申请人： CORNING INCORPORATED

    发明人： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

    IPC分类号： G02B6/36 ,  C03C27/08 ,  C03B37/15 ,  G02B6/10

    摘要： Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

    LASER SEALED HOUSING FOR ELECTRONIC DEVICE
    8.
    发明申请
    LASER SEALED HOUSING FOR ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200238437A1

    公开(公告)日：2020-07-30

    申请号：US15754975

    申请日：2016-08-23

    申请人： Corning Incorporated

    发明人： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

    IPC分类号： B23K26/0622 ,  H01L51/52 ,  B23K26/20 ,  B23K26/211 ,  B23K26/324

    摘要： A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.

    QUANTUM-DOT LED BACKLIGHT MODULE FOR LED DISPLAYS
    9.
    发明申请
    QUANTUM-DOT LED BACKLIGHT MODULE FOR LED DISPLAYS 审中-公开

    公开(公告)号：US20200161509A1

    公开(公告)日：2020-05-21

    申请号：US16627464

    申请日：2018-06-29

    申请人： CORNING INCORPORATED

    发明人： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  William Allen Wood

    IPC分类号： H01L33/50 ,  H01L33/06 ,  H01L33/54

    摘要： The QD LED module (10) disclosed herein includes a support assembly (40), a circuit board (20), an LED (30) operably supported by the circuit board, wherein the LED emits blue light (36G). The QD LED module also has a QD structure (60) supported by the support assembly and axially spaced apart from the LED surface. The QD structure has an active area (AR) that includes a first region (R1) of QD material and a second region (R2) that has no QD material. A first portion of the blue light passes through the first region and is converted to red light (36R) and green light (36G). A second portion of the blue light passes through the second region. The QD material has a CIE color point that is shifted toward the yellow portion of the color space.