公开(公告)号：US20240247455A1

公开(公告)日：2024-07-25

申请号：US18100679

申请日：2023-01-24

申请人： GM Global Technology Operations LLC

发明人： Satendra S. GURU ,  Fellpe CUELLAR-FERREIRA ,  Babak MAKKINEJAD ,  Maria Rossana RUIZ ,  Douglas James SPRY

IPC分类号： E02D3/11 ,  B23K26/06 ,  B23K26/324 ,  G01N21/21 ,  G01S7/48 ,  G01S17/08

CPC分类号： E02D3/11 ,  B23K26/0608 ,  B23K26/324 ,  G01N21/21 ,  G01S7/4802 ,  G01S17/08

摘要： A lunar rover includes a lunar rover body, at least one wheel coupled with the lunar rover body, a drive module coupled with the at least one wheel, the drive module configured to drive rotation of the at least one wheel over a surface, an extension arm coupled to the lunar rover body, an emitter array coupled to the extension arm, and a controller electrically connected with the emitter array. The controller is configured to control the emitter array to emit at least one of laser electromagnetic waves or maser electromagnetic waves towards the surface to sinter lunar regolith particles on the surface.

公开(公告)号：US11839930B2

公开(公告)日：2023-12-12

申请号：US16210087

申请日：2018-12-05

申请人： Bayerische Motoren Werke Aktiengesellschaft

发明人： Maik Hammer ,  Johann van Niekerk ,  Alexander Grimm

IPC分类号： B23K26/0622 ,  B23K26/06 ,  B23K26/22 ,  B23K26/26 ,  B23K26/322 ,  B23K26/324 ,  B23K26/323 ,  B23K26/242 ,  B23K26/244 ,  B23K26/062 ,  B23K101/00 ,  B23K101/34 ,  B23K103/06 ,  B23K103/20 ,  B23K103/00

CPC分类号： B23K26/0622 ,  B23K26/062 ,  B23K26/0626 ,  B23K26/22 ,  B23K26/242 ,  B23K26/244 ,  B23K26/26 ,  B23K26/322 ,  B23K26/323 ,  B23K26/324 ,  B23K2101/006 ,  B23K2101/34 ,  B23K2103/06 ,  B23K2103/20 ,  B23K2103/42

摘要： A method for welding components includes the following steps: providing a first component and a second component; bringing together the two components; welding the two components by use of a laser beam, wherein a plurality of welding impulses are generated through the repeated activation and deactivation of the laser beam, with each welding pulse being interrupted by welding-free rest intervals in which the laser beam is deactivated, wherein a local welding area is generated by each welding pulse, in which material of the two components is melted and fused in a locally limited manner, wherein individual welding areas of those generated by the welding pulses overlap.

公开(公告)号：US20230393310A1

公开(公告)日：2023-12-07

申请号：US18033152

申请日：2021-10-07

申请人： CORNING INCORPORATED

发明人： Naigeng Chen ,  Stephan Lvovich Logunov ,  Weiwei Luo ,  Mark Alejandro Quesada ,  Bo Yang

IPC分类号： G02B3/14 ,  B23K26/57 ,  B23K26/324 ,  G02B26/00 ,  B23K31/12

CPC分类号： G02B3/14 ,  B23K26/57 ,  B23K2103/54 ,  G02B26/005 ,  B23K31/12 ,  B23K26/324

摘要： A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of the bonds has a strength, and the strength of the bonds increases sequentially from the innermost bond to the outermost bond. The strength of each bond is sufficiently low such that the bonds fail in response to liquid (within a cavity defined by the first substrate, a third substrate, and the through-hole of the second substrate) exerting pressure on the first substrate instead of the first substrate failing. Each of the bonds are configured to fail at approximately the same pressure exerted upon the first substrate by the liquid. Additionally disclosed is a method of manufacturing the device.

公开(公告)号：US11701839B2

公开(公告)日：2023-07-18

申请号：US16439167

申请日：2019-06-12

申请人： Airbus Operations GmbH

发明人： Tassilo Witte

IPC分类号： B29C65/16 ,  B23K26/06 ,  B23K26/067 ,  B23K26/08 ,  B23K26/244 ,  B23K26/324 ,  B29C65/00 ,  B29C65/78 ,  B23K26/70 ,  B29L31/30 ,  B23K101/00 ,  B23K103/00 ,  B29K701/12

CPC分类号： B29C65/1645 ,  B23K26/0604 ,  B23K26/0643 ,  B23K26/0652 ,  B23K26/0676 ,  B23K26/08 ,  B23K26/244 ,  B23K26/324 ,  B23K26/702 ,  B29C65/7802 ,  B29C66/1122 ,  B23K2101/006 ,  B23K2103/42 ,  B29K2701/12 ,  B29L2031/3005

摘要： A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.

公开(公告)号：US20230202920A1

公开(公告)日：2023-06-29

申请号：US18177778

申请日：2023-03-03

申请人： Q.ANT GMBH

发明人： Felix ZIMMERMANN ,  Michael FOERTSCH ,  Stefan HENGESBACH ,  Eugen ERMANTRAUT

IPC分类号： C03C27/00 ,  B23K26/211 ,  B23K26/0622 ,  B23K26/324 ,  G02F1/355 ,  G02F1/365

CPC分类号： C03C27/00 ,  B23K26/211 ,  B23K26/0624 ,  B23K26/324 ,  G02F1/3551 ,  G02F1/365 ,  B23K2103/54

摘要： A method for joining an optical crystal to a substrate includes radiating a pulsed laser beam through the optical crystal or through the substrate onto a surface of an intermediate layer between the optical crystal and the substrate, and forming a fusion zone in the intermediate layer between the optical crystal and the substrate by the radiation of the pulsed laser beam, thereby integrally joining the optical crystal and the substrate.

公开(公告)号：US20190232569A1

公开(公告)日：2019-08-01

申请号：US16378440

申请日：2019-04-08

申请人： Picosys Incorporated

发明人： Raymond Miller Karam ,  Georges Roussos ,  Mark Finkle ,  Daniella M. Harvey ,  Pascal R. Ackermann-Karam

IPC分类号： B29C65/16 ,  B23K26/244 ,  B29C65/00 ,  B23K37/04 ,  C03B23/203 ,  B29C65/78 ,  B23K26/211 ,  B23K26/32 ,  B23K26/0622 ,  B23K26/082 ,  C03C27/00 ,  B23K26/324 ,  B01L3/00 ,  B23K26/08 ,  B23K26/046 ,  B23K26/03 ,  B32B37/06

CPC分类号： B29C65/1612 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0887 ,  B23K26/032 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/211 ,  B23K26/244 ,  B23K26/32 ,  B23K26/324 ,  B23K37/0435 ,  B23K2101/18 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1683 ,  B29C65/7841 ,  B29C65/7847 ,  B29C66/1122 ,  B29C66/45 ,  B29C66/73161 ,  B29C66/7392 ,  B29C66/7465 ,  B32B37/06 ,  B32B2307/412 ,  B32B2310/0843 ,  B32B2315/08 ,  C03B23/203 ,  C03C27/00

摘要： A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

公开(公告)号：US20190001441A1

公开(公告)日：2019-01-03

申请号：US16062193

申请日：2016-12-15

申请人： SABIC GLOBAL TECHNOLOGIES B.V.

发明人： Hao Gu ,  Hyemin Park ,  Norio Ozawa ,  Josephus Gerardus M. van Gisbergen ,  Atsushi Ebisawa

IPC分类号： B23K26/352 ,  B23K26/00 ,  B23K26/324 ,  B29C45/14 ,  B32B37/15 ,  B32B37/18

CPC分类号： B23K26/355 ,  B23K26/0093 ,  B23K26/324 ,  B29C45/14311 ,  B29C65/18 ,  B29C65/8215 ,  B29C65/8253 ,  B29C66/0246 ,  B29C66/1122 ,  B29C66/30325 ,  B29C66/30326 ,  B29C66/45 ,  B29C66/71 ,  B29C66/742 ,  B29C66/7422 ,  B29C66/7428 ,  B29C66/74281 ,  B29C66/74283 ,  B29C66/83221 ,  B29C66/83413 ,  B29C66/919 ,  B29C66/929 ,  B29C2791/009 ,  B29K2105/0079 ,  B29K2705/00 ,  B32B37/153 ,  B32B37/182 ,  B32B37/203 ,  B29K2055/02 ,  B29K2001/00 ,  B29K2001/12 ,  B29K2023/38 ,  B29K2023/083 ,  B29K2023/086 ,  B29K2027/12 ,  B29K2027/06 ,  B29K2059/00 ,  B29K2033/12 ,  B29K2033/20 ,  B29K2077/00 ,  B29K2079/085 ,  B29K2023/18 ,  B29K2067/006 ,  B29K2027/18 ,  B29K2067/003 ,  B29K2069/00 ,  B29K2071/00 ,  B29K2081/06 ,  B29K2079/08 ,  B29K2067/046 ,  B29K2071/12 ,  B29K2081/04 ,  B29K2023/12 ,  B29K2025/06 ,  B29K2075/00 ,  B29K2031/04 ,  B29K2027/08 ,  B29K2025/08

摘要： Various embodiments relate to plastic-metal junctions and methods of making the same via laser-assisted joining. The present invention provides a method of forming a junction between a metal form and a solid plastic. The method can include laser treating a surface of a metal form to generate a feature (e.g., a plurality of at least one of pores and grooves) in the surface of the metal, wherein the laser has an angle of incidence with the surface of the metal of other than 0 degrees. The method can include contacting the metal surface including the feature with a flowable resin composition. The method can include curing the flowable resin composition to form the solid plastic, to provide the junction between the metal form and the solid plastic.

公开(公告)号：US20180214977A1

公开(公告)日：2018-08-02

申请号：US15848127

申请日：2017-12-20

申请人： Illumina, Inc.

发明人： Peter Mains ,  Anmiv S. Prabhu ,  Richard Capella ,  Kevan Samiee

IPC分类号： B23K26/02 ,  B29C65/78 ,  B23K26/21

CPC分类号： B23K26/02 ,  B23K26/032 ,  B23K26/0853 ,  B23K26/21 ,  B23K26/324 ,  B23K26/38 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/54 ,  B29C65/7814

摘要： Wafers are aligned with one another by reference to features formed on or in each wafer. Notches are formed in each wafer, including a pivot-notch that allows for two-point contact, and a stop-notch that provides for single-point contact. A bias-notch is formed for pressing the wafers into engagement with the two-contact element when it is in the pivot-notch and with the single-contact element when it is in the stop-notch. The wafers may be bonded to one another to maintain the alignment of the referenced features.

公开(公告)号：US20170348789A1

公开(公告)日：2017-12-07

申请号：US15536971

申请日：2015-12-17

申请人： Outokumpu Oyj

发明人： Thomas Fröhlich ,  Stefan Lindner

IPC分类号： B23K11/11 ,  B32B37/00 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B23K10/02 ,  B23K11/06 ,  B23K11/20 ,  B23K26/32 ,  B23K26/322 ,  B23K26/324 ,  B32B7/04 ,  B32B3/30 ,  B32B3/28 ,  B23K26/21 ,  B32B37/22 ,  B32B37/14 ,  B32B7/12 ,  B23K26/323 ,  B23K103/04 ,  B23K103/08 ,  B23K103/16 ,  B23K103/00 ,  B23K103/10 ,  B23K103/12 ,  B23K103/18

CPC分类号： B23K11/11 ,  B23K10/022 ,  B23K11/067 ,  B23K11/16 ,  B23K11/20 ,  B23K26/21 ,  B23K26/32 ,  B23K26/322 ,  B23K26/323 ,  B23K26/324 ,  B23K2103/04 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/15 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/18 ,  B23K2103/42 ,  B32B3/266 ,  B32B3/28 ,  B32B3/30 ,  B32B7/02 ,  B32B7/05 ,  B32B7/12 ,  B32B15/00 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B33/00 ,  B32B37/0084 ,  B32B37/04 ,  B32B37/144 ,  B32B37/223 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/546 ,  B32B2419/04 ,  B32B2607/00

摘要： The invention relates to a method for manufacturing a sandwich panel as a semi-finished product where at least one layer of a non-metallic material is positioned between at least two metallic layers. At least one of the metal layers is shaped into a three dimensional layer, and the metal layers are in direct mechanical contact to enable resistance weldability of the semi-finished product in order to connect the semi-finished product to a desired combination of solutions in a subsequent manufacturing process.

公开(公告)号：US20170146030A1

公开(公告)日：2017-05-25

申请号：US15422830

申请日：2017-02-02

申请人： TERUMO KABUSHIKI KAISHA

发明人： Shinpei Furukawa

IPC分类号： F04D29/62 ,  F04D29/42 ,  B23K26/18 ,  F04D7/04 ,  B23K26/21 ,  A61M1/10 ,  F04D29/046

CPC分类号： F04D29/628 ,  A61M1/10 ,  A61M1/101 ,  A61M1/1012 ,  A61M1/1013 ,  A61M1/1029 ,  A61M1/1036 ,  A61M1/122 ,  A61M2207/00 ,  B23K26/0823 ,  B23K26/18 ,  B23K26/21 ,  B23K26/282 ,  B23K26/324 ,  B23K37/0435 ,  B23K2103/42 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1658 ,  B29C65/1683 ,  B29C65/7841 ,  B29C66/12841 ,  B29C66/1286 ,  B29C66/543 ,  B29C66/65 ,  B29C66/71 ,  B29C66/73115 ,  B29C66/73921 ,  B29C66/8322 ,  B29L2031/7496 ,  B29L2031/753 ,  F04D7/04 ,  F04D13/024 ,  F04D29/026 ,  F04D29/041 ,  F04D29/046 ,  F04D29/426 ,  F05D2230/234 ,  B29K2027/06 ,  B29K2023/06 ,  B29K2023/12 ,  B29K2025/06 ,  B29K2069/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2081/06

摘要： A centrifugal blood pump prevents a shaft member from oscillating due to expansion of a pump housing resulting from pressurization of the blood. The centrifugal blood pump is manufactured by assembling a bottom member 21 and a lid member 22, and compressing them in a direction in which the bottom member 21 and the lid member 22 approach each other by a deformation amount along their outer circumferential walls. The lid member and the bottom member are joined while in the compressed state in order to create a preloading force between the shaft member and bearings to resist the expansion due to pressurization of the blood during use.