公开(公告)号：US20230174423A1

公开(公告)日：2023-06-08

申请号：US18076849

申请日：2022-12-07

Applicant: CORNING INCORPORATED

Inventor： Dorothy Roberta Behan ,  Donald Seton Farquhar ,  Uta-Barbara Goers ,  Tammy Lynn Petriwsky

IPC: C03C23/00 ,  C03C3/06 ,  C03C17/06 ,  C03C17/00

CPC classification number: C03C23/007 ,  C03C3/06 ,  C03C17/06 ,  C03C17/004 ,  C03C2201/02 ,  C03C2203/52 ,  C03C2217/25 ,  C03C2218/32

Abstract: A wafer including a glass substrate is provided. The glass substrate includes a first surface defining a plane and including a surface roughness Ra of approximately 0.3 nm in an outer via region and a second surface. The glass substrate defines a plurality of vias extending from the first surface. The plurality of vias each include an entrance defined by the first surface.