公开(公告)号：US20230337543A1

公开(公告)日：2023-10-19

申请号：US18136578

申请日：2023-04-19

Applicant: CORNING INCORPORATED

Inventor： Ling Cai ,  JaeMyung Chang ,  Yang Liu ,  Jungwon Seo ,  Cheng-Gang Zhuang

IPC: H10N30/30 ,  H10N30/853 ,  H10N30/87 ,  H10N30/88 ,  H10N30/076 ,  A61B5/00 ,  C04B41/00 ,  C04B41/45 ,  C04B41/50 ,  C04B41/48 ,  C04B41/52 ,  C04B41/89 ,  C04B41/87 ,  C04B41/83

CPC classification number: H10N30/302 ,  H10N30/853 ,  H10N30/87 ,  H10N30/88 ,  H10N30/076 ,  A61B5/6802 ,  C04B41/009 ,  C04B41/4531 ,  C04B41/5054 ,  C04B41/48 ,  C04B41/522 ,  C04B41/89 ,  C04B41/87 ,  C04B41/83

Abstract: Embodiments of a sensor are disclosed herein. The sensor includes a ceramic substrate having a first major surface, a second major surface opposite to the first major surface, and a thickness measured from the first major surface to the second major surface. The thickness is from 10 μm to 200 μm. A piezoelectric layer is disposed on the first major surface of the ceramic substrate, and the piezoelectric layer has a thickness of 10 μm or less. At least one electrical contact is disposed on the piezoelectric layer or between the ceramic substrate and the piezoelectric layer or both on the piezoelectric layer and between the ceramic substrate and the piezoelectric layer. A wearable device including such a sensor is also disclosed herein as well as a method of manufacturing same.