Incorporating heat spreader to electronics enclosure for enhanced cooling

    公开(公告)号:US11586259B2

    公开(公告)日:2023-02-21

    申请号:US17235040

    申请日:2021-04-20

    Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

    INCORPORATING HEAT SPREADER TO ELECTRONICS ENCLOSURE FOR ENHANCED COOLING

    公开(公告)号:US20220334624A1

    公开(公告)日:2022-10-20

    申请号:US17235040

    申请日:2021-04-20

    Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.

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