公开(公告)号：US10741920B2

公开(公告)日：2020-08-11

申请号：US16163601

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q5/50 ,  H01Q9/04 ,  H01Q5/385 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.

公开(公告)号：US11177572B2

公开(公告)日：2021-11-16

申请号：US16924461

申请日：2020-07-09

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q9/38 ,  H01Q9/04 ,  H01Q5/385 ,  H01Q5/50 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.

公开(公告)号：US20200343640A1

公开(公告)日：2020-10-29

申请号：US16924461

申请日：2020-07-09

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q9/04 ,  H01Q5/385 ,  H01Q5/50 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.