公开(公告)号：US10741920B2

公开(公告)日：2020-08-11

申请号：US16163601

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q5/50 ,  H01Q9/04 ,  H01Q5/385 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.

公开(公告)号：US20230037629A1

公开(公告)日：2023-02-09

申请号：US17815597

申请日：2022-07-28

Applicant: CommScope Technologies LLC

Inventor： Michael L. Brobston ,  Jonathon C. Veihl

IPC: H01Q3/24 ,  H04B7/0426 ,  H01Q5/335

Abstract: A radio node includes RF circuitry and an antenna array that includes a plurality of columns of radiating elements, the antenna array coupled to the RF circuitry. The antenna array is configured to have a discrete set of beam states in an elevation plane of the antenna array. A first subset of the discrete set of beam states is associated with the radio node being mounted in a wall mount configuration and a second subset of the discrete set of beam states is associated with radio node being mounted in a ceiling mount configuration.

公开(公告)号：US20190115664A1

公开(公告)日：2019-04-18

申请号：US16163601

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D.L. Bernardo

IPC: H01Q9/04 ,  H01Q5/50 ,  H01Q5/385

CPC classification number: H01Q9/0414 ,  H01Q5/385 ,  H01Q5/50 ,  H01Q9/0435 ,  H01Q21/0087 ,  H01Q21/065

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.

公开(公告)号：US11177572B2

公开(公告)日：2021-11-16

申请号：US16924461

申请日：2020-07-09

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q9/38 ,  H01Q9/04 ,  H01Q5/385 ,  H01Q5/50 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.

公开(公告)号：US20200343640A1

公开(公告)日：2020-10-29

申请号：US16924461

申请日：2020-07-09

Applicant: CommScope Technologies LLC

Inventor： Jonathon C. Veihl ,  Michael L. Brobston ,  Richard W. Brown ,  Charles D. L. Bernardo

IPC: H01Q9/04 ,  H01Q5/385 ,  H01Q5/50 ,  H01Q21/06 ,  H01Q21/00

Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.