公开(公告)号：US09231124B2

公开(公告)日：2016-01-05

申请号：US14036017

申请日：2013-09-25

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Binghua Pan ,  Yew Kwang Low ,  Sim Ying Yong

IPC: H01L31/00 ,  H01L31/02 ,  H01L27/146

CPC classification number: H01L31/02005 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.

Abstract translation: 提供了一种将球栅阵列（BGA）封装的相机装置附接到印刷电路板（PCB）基板的组件。 组件包括在装置和基板之间的间隔件。 隔离件构造成防止在焊球回流期间位于装置和基板之间的焊球的过度塌陷。 间隔物包括焊接掩模，胶带和/或图例油墨之一。