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公开(公告)号：US10276522B2
公开(公告)日：2019-04-30
申请号：US14819446
申请日：2015-08-06
Applicant: DELTA ELECTRONICS, INC.
Inventor： Tao Wang , Zhen-Qing Zhao , Kai Lu , Zheng-Fen Wan , Hai-Bin Xu
Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.
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