公开(公告)号：US20220270948A1

公开(公告)日：2022-08-25

申请号：US17740926

申请日：2022-05-10

Applicant: DENSO CORPORATION

Inventor： Hiroshi UKEGAWA ,  Takanori KAWASHIMA ,  Akinori SAKAKIBARA

IPC: H01L23/367 ,  H01L23/373

Abstract: The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.

公开(公告)号：US20250062180A1

公开(公告)日：2025-02-20

申请号：US18938667

申请日：2024-11-06

Applicant: DENSO CORPORATION

Inventor： Hiroshi UKEGAWA ,  Takanori KAWASHIMA ,  Akinori SAKAKIBARA

IPC: H01L23/367 ,  H01L23/373

Abstract: The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.