公开(公告)号：US20240215211A1

公开(公告)日：2024-06-27

申请号：US18594278

申请日：2024-03-04

Applicant: DENSO CORPORATION

Inventor： Tetsuya MATSUOKA ,  Yuta Hashimoto ,  Tomoki Kozawa ,  Kazuya Takeuchi ,  Shinji Takai ,  Takahiro Shimizu

IPC: H05K7/20 ,  H02M7/00 ,  H02M7/537

CPC classification number: H05K7/20927 ,  H02M7/003 ,  H02M7/537

Abstract: The power conversion device has a case, a semiconductor module, a first cooler that cools the semiconductor module from one side, a second cooler that cools the semiconductor module from the back side, and a coupling pipe that couples a flow path of the first cooler with a flow path of the second cooler. A flow rate of the refrigerant is made different between the flow paths, and the flow path having a larger flow rate is larger in cross-sectional area than the flow path having a smaller flow rate. The first cooler having a wider flow path is formed by a part of the case that houses the semiconductor module, and the second cooler having a narrower flow path is housed in the case together with the semiconductor module.