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公开(公告)号:US20200036297A1
公开(公告)日:2020-01-30
申请号:US16526762
申请日:2019-07-30
Applicant: DENSO CORPORATION
Inventor: Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA , Akifumi ARARAGI , Noriyuki KAKIMOTO , Masakiyo SUMITOMO
Abstract: In a power converter, a control circuit has a speed adjustment resistor that limits a control current to adjust a switching speed of each of first and second switching elements. The speed adjustment resistor has a resistance that varies depending on a voltage at the control electrode of each of the first and second switching elements. A feedback route connects between the control electrode of the first switching element and the control electrode of the second switching element. The feedback route has a resistance that is set to be lower than a value of the resistance of the speed adjustment resistor during a predetermined Miller period of each of the first and second switching elements.
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公开(公告)号:US20170302153A1
公开(公告)日:2017-10-19
申请号:US15491366
申请日:2017-04-19
Applicant: DENSO CORPORATION
Inventor: Kengo MOCHIKI , Mitsunori KIMURA , Hiroshi SHIMIZU , Yasuyuki OHKOUCHI , Yuu YAMAHIRA , Tetsuya MATSUOKA , Kazuma FUKUSHIMA
CPC classification number: H02M1/088 , B60L3/003 , B60L3/0084 , B60L15/007 , H01L27/0623 , H01L2224/05554 , H01L2224/48247 , H02M1/08 , H02M3/158 , H02M7/003 , H02M7/537 , H02M7/53871 , H02M2001/0054 , H02P27/06 , H03K17/0412 , H03K17/08116 , H03K17/127 , H03K17/6871 , H03K2217/0036
Abstract: A power conversion apparatus includes a semiconductor module including a semiconductor device and a control circuit unit controlling the semiconductor module. The semiconductor module has main and subsidiary semiconductor devices connected in parallel. The control circuit unit performs control such that the subsidiary semiconductor device is turned on after the main semiconductor device is turned on, and the main semiconductor device is turned off after the subsidiary semiconductor device is turned off. The control circuit unit performs control such that, one of the turn-on and turn-off switching timings has a switching speed faster than that of the other of the switching timings. The semiconductor module is configured such that, at a high-speed switching timing, an induction current directed to turn off the subsidiary semiconductor device is generated in a control terminal of the subsidiary semiconductor device depending on temporal change of a main current flowing to the main semiconductor device.
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公开(公告)号:US20160157381A1
公开(公告)日:2016-06-02
申请号:US14919161
申请日:2015-10-21
Applicant: DENSO CORPORATION
Inventor: Kazuya TAKEUCHI , Makoto OKAMURA , Yuuichi HANDA , Naoki HIRASAWA , Hiromi ICHIJO , Ryota TANABE , Tetsuya MATSUOKA
CPC classification number: H05K7/20927 , H01G2/08 , H01G4/236 , H01G4/35 , H01G4/40 , H01L23/473 , H01L2023/4025 , H02M7/003 , Y02T10/7022
Abstract: An electric power converter includes a semiconductor module constituting a power conversion circuit, a capacitor electrically connected to the semiconductor module, and a cooling member for cooling the capacitor. The capacitor includes an element body provided with internal electrode, and a pair of end-face-electrodes provided on both end faces of the element body and connected to the internal electrode. The pair of end-face-electrodes are connected with a pair of bus bars, respectively, in a manner of surface contact. The capacitor is disposed in a state where one of the pair of end-face-electrodes is facing the cooling member. The end-face-electrode facing the cooling member is in contact with the cooling member via the bus bar.
Abstract translation: 电力转换器包括构成功率转换电路的半导体模块,与半导体模块电连接的电容器和用于冷却电容器的冷却构件。 电容器包括设置有内部电极的元件本体和设置在元件体的两个端面上并连接到内部电极的一对端面电极。 一对端面电极分别与一对母线以表面接触的方式连接。 电容器设置在一对端面电极中的一个面对冷却部件的状态。 面向冷却部件的端面电极经由母线与冷却部件接触。
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公开(公告)号:US20130272046A1
公开(公告)日:2013-10-17
申请号:US13846462
申请日:2013-03-18
Applicant: DENSO CORPORATION
Inventor: Tetsuya MATSUOKA , Hiroyoshi SAWADA , Makoto OKAMURA , Hiroshi INAMURA , Yasuaki AOKI
IPC: H02M7/5387
CPC classification number: H02M7/5387 , H01L24/33 , H01L2924/13055 , H02M7/003 , H01L2924/00
Abstract: The power conversion device includes a plurality of semiconductor modules, each having a main body section including a switching element therein. In a module unit, a positive module and a negative module are disposed such that main surfaces of the respective main body sections oppose each other. A positive terminal, a first intermediate terminal, a negative terminal, and a second intermediate terminal project in a Z direction perpendicular to X direction in which the positive module and the negative module oppose each other. A first vector V1 from the positive terminal towards the first intermediate terminal and a second vector V2 from the second intermediate terminal towards the negative terminal are configured such that these vector components V12 and V22 in a Y direction perpendicular are opposite to each other.
Abstract translation: 电力转换装置包括多个半导体模块,每个半导体模块具有包括开关元件的主体部分。 在模块单元中,设置正模块和负模块,使得各个主体区段的主表面彼此相对。 正极端子,第一中间端子,负极端子和第二中间端子在与正方形模块和负极模块相对的X方向垂直的Z方向上突出。 从正端子朝向第一中间端子的第一矢量V1和从第二中间端子向负极端子的第二矢量V2被配置为使得这些矢量分量V12和V22在Y方向垂直的方向彼此相反。
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公开(公告)号:US20230328938A1
公开(公告)日:2023-10-12
申请号:US18334429
申请日:2023-06-14
Applicant: DENSO CORPORATION
Inventor: Tetsuya MATSUOKA , Yuta HASHIMOTO , Kazuya TAKEUCHI , Tomoki KOZAWA
IPC: H05K7/20
CPC classification number: H05K7/20936 , H05K7/20327
Abstract: A power module has a semiconductor module and a cooling device. The cooling device has a cooling unit provided in the semiconductor module so as to be capable of conducting heat, a supply pipe configured to supply refrigerant to an interior of the cooling unit, and a discharge pipe configured to discharge the refrigerant that is flowed inside the cooling unit. The semiconductor module and the cooling unit are arranged in a z-direction. The supply pipe and the discharge pipe are spaced apart in a x-direction. Each of the supply pipe and the discharge pipe faces the semiconductor module in a y-direction.
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公开(公告)号:US20210167694A1
公开(公告)日:2021-06-03
申请号:US17170978
申请日:2021-02-09
Applicant: DENSO CORPORATION
Inventor: Masaya TONOMOTO , Tetsuya MATSUOKA , Hiromi ICHIJO
Abstract: In a power converter, electronic components constituting a power conversion circuit is provided. A capacitor module and a converter case are also provided in the power converter. Fastening members, which include a first fastening member and a second fastening member, are configured to fasten the capacitor module to the converter case. The first and second fastening members are mounted on the inner bottom surface of the converter case. At least one of the electronic components is mounted to the capacitor module and is arranged between the first fastening member and the second fastening member when viewed in a view direction perpendicular to an alignment direction of the first and second fastening members. The view direction is parallel to the inner bottom surface of the converter case.
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公开(公告)号:US20200176435A1
公开(公告)日:2020-06-04
申请号:US16785913
申请日:2020-02-10
Applicant: DENSO CORPORATION
Inventor: Kazuma FUKUSHIMA , Yuu YAMAHIRA , Ryota TANABE , Tetsuya MATSUOKA , Kosuke KAMIYA , Taijiro MOMOSE
Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.
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公开(公告)号:US20170142860A1
公开(公告)日:2017-05-18
申请号:US15353337
申请日:2016-11-16
Applicant: DENSO CORPORATION
Inventor: Kazuya TAKEUCHI , Tetsuya MATSUOKA , Ryota TANABE
CPC classification number: H05K7/209 , B60L15/007 , B60L2210/40 , B60L2240/525 , H01L23/473 , H02M7/003 , H02M7/537 , H05K5/0256 , H05K5/04 , H05K7/2049 , H05K7/20927
Abstract: An electric power converter performing power conversion includes a plurality of semiconductor modules with built-in semiconductor elements, a plurality of cooling tubes stacked together with the plurality of semiconductor modules, and a pressure member made of metal. The pressure member has a pressing surface for pressing an outer cooling tube in order to press-contact the plurality of cooling tubes and the plurality of semiconductor modules in a stacking direction, and a heat receiving surface that receives heat generated from a capacitor that is an electronic component which is different from the plurality of semiconductor modules, by thermal conduction.
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公开(公告)号:US20240213887A1
公开(公告)日:2024-06-27
申请号:US18594127
申请日:2024-03-04
Applicant: DENSO CORPORATION
Inventor: Tetsuya MATSUOKA , Yuta HASHIMOTO , Masataka DEGUCHI , Tatsuya MURAKAMI , Yoshinori HAYASHI
CPC classification number: H02M7/537 , H02M7/003 , H05K7/20927
Abstract: In a power conversion device, first-phase semiconductor modules are successively arranged in a first direction to form a part of a first row. Second-phase semiconductor modules are successively arranged in the first direction to form a part of a second row while facing the first-phase semiconductor modules. Third-phase semiconductor modules are arranged in a second direction so that one of the third-phase semiconductor modules forms a part of the first row and another of the third-phase semiconductor modules forms a part of the second row. The first row and the second row have surfaces facing each other and from which output terminals protrude. Each of output conductors extends from a connected portion of an output terminal in a direction away from the third-phase semiconductor modules.
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公开(公告)号:US20200321319A1
公开(公告)日:2020-10-08
申请号:US16904088
申请日:2020-06-17
Applicant: DENSO CORPORATION
Inventor: Tetsuya MATSUOKA , Yuu YAMAHIRA , Kazuma FUKUSHIMA , Noriyuki KAKIMOTO
IPC: H01L25/07 , H01L25/18 , H02M7/48 , H01L29/739
Abstract: A power converter includes: at least one pair of first and second semiconductor devices including multiple first and second semiconductor chips, having first and second switching elements providing upper and lower arms, and multiple first and second main terminals having at least one of multiple first and second high potential terminals and multiple first and second low potential terminals; and a bridging member providing an upper and lower coupling portion, together with the first low and second high potential terminals. The first and second semiconductor chips are arranged in line symmetry with respect to first and second axes and in line symmetry with the second axis as a symmetry axis to differentiate the arrangement of the second low potential terminal with respect to the second high potential terminal from the arrangement of the first low potential terminal with respect to the first high potential terminal.
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