公开(公告)号：US10535577B2

公开(公告)日：2020-01-14

申请号：US16088093

申请日：2017-04-27

Applicant: DENSO CORPORATION

Inventor： Hiroshi Ishino ,  Hideki Kawahara ,  Shinji Hiramitsu ,  Shunsuke Arai

IPC: H01L23/36 ,  H01L25/07 ,  H02M7/48 ,  H01L23/00

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.

公开(公告)号：US11270984B2

公开(公告)日：2022-03-08

申请号：US16731244

申请日：2019-12-31

Applicant: DENSO CORPORATION

Inventor： Shunsuke Arai ,  Shinji Hiramitsu ,  Takuo Nagase

IPC: H01L25/07 ,  H01L23/00 ,  H02M7/537

Abstract: In a semiconductor module, two switching elements are connected in parallel to each other. Each of the switching elements includes a first main electrode formed on one surface side, and a second main electrode and a gate electrode formed on a rear surface side opposite to the one surface side. A first conductor plate is coupled with two first main terminals at first coupling portions and is electrically connected with the first main electrodes. A second conductor plate is coupled with one second main terminal at a second coupling portion and is electrically connected with the second main electrodes. The second coupling portion is disposed between the switching elements in an alignment direction of the switching elements, and the first coupling portions are provided on both sides of the second coupling portion in the alignment direction.

公开(公告)号：US10854589B2

公开(公告)日：2020-12-01

申请号：US16507240

申请日：2019-07-10

Applicant: DENSO CORPORATION

Inventor： Satoru Sugita ,  Ryota Tanabe ,  Shunsuke Arai

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/367 ,  H01L23/473 ,  H01L29/417 ,  H02M7/537

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.