公开(公告)号：US20230328938A1

公开(公告)日：2023-10-12

申请号：US18334429

申请日：2023-06-14

Applicant: DENSO CORPORATION

Inventor： Tetsuya MATSUOKA ,  Yuta HASHIMOTO ,  Kazuya TAKEUCHI ,  Tomoki KOZAWA

IPC: H05K7/20

CPC classification number: H05K7/20936 ,  H05K7/20327

Abstract: A power module has a semiconductor module and a cooling device. The cooling device has a cooling unit provided in the semiconductor module so as to be capable of conducting heat, a supply pipe configured to supply refrigerant to an interior of the cooling unit, and a discharge pipe configured to discharge the refrigerant that is flowed inside the cooling unit. The semiconductor module and the cooling unit are arranged in a z-direction. The supply pipe and the discharge pipe are spaced apart in a x-direction. Each of the supply pipe and the discharge pipe faces the semiconductor module in a y-direction.