公开(公告)号：US20200241186A1

公开(公告)日：2020-07-30

申请号：US16753161

申请日：2018-10-02

Applicant: Dexerials Corporation

Inventor： Eiji OHTA ,  Tsutomu NAGAHAMA ,  Shigehisa OHKAWARA ,  Tatsuya HARIMARA ,  Katsuhiro DOI ,  Kazuhiko NODA ,  Akihiro SHIBATA ,  Kazuo GOTO ,  Yasuyuki KUDO

IPC: G02B5/28 ,  E06B9/24

Abstract: An optical body including: a first optical layer which has a surface having a convex profile in which a plurality of one-directionally extending elongated convex portions are one-dimensionally aligned in one direction; an inorganic layer disposed on the surface of the first optical layer on a side having the convex profile and a second optical layer disposed on a side of the inorganic layer so that the convex profile is embedded; wherein the convex profile meets at least one of the following (1) to (4): (1) a height varies in an extending direction in each of the elongated convex portions, (2) a ridge portion meanders in a direction perpendicular to both the extending direction and a height direction of the convex portion in each of the elongated convex portions, (3) heights of the elongated convex portions adjacent to each other are different from each other, and (4) a triangular prism-shaped convex portion and an elongated convex portion having a curved surface are adjacent to each other.

公开(公告)号：US20190159345A1

公开(公告)日：2019-05-23

申请号：US15735772

申请日：2016-06-22

Applicant: DEXERIALS CORPORATION

Inventor： Makiya ITO ,  Ryosuke ENDO ,  Kazuo GOTO

IPC: H05K3/12 ,  H05K3/38 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/1208 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/09 ,  H05K3/381 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/09681 ,  H05K2203/0195 ,  H05K2203/1105 ,  H05K2203/1173

Abstract: A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m2.