公开(公告)号：US12096551B2

公开(公告)日：2024-09-17

申请号：US17834971

申请日：2022-06-08

Applicant: Equal 1 Laboratories Ireland Limited

Inventor： Hans Haenlein ,  Dirk Robert Walter Leipold ,  Ali Esmailiyan

IPC: H05K1/11 ,  F17C13/00 ,  H01B7/08 ,  H01R12/59 ,  H01R12/77 ,  H01R12/79 ,  H05K1/02 ,  H05K1/03 ,  G06N10/40

CPC classification number: H05K1/0224 ,  H01B7/0861 ,  H01R12/594 ,  H01R12/775 ,  H01R12/79 ,  H05K1/0393 ,  H05K1/118 ,  G06N10/40 ,  H05K2201/0154 ,  H05K2201/0715 ,  H05K2201/09681 ,  H05K2201/10189 ,  H05K2201/10356

Abstract: A novel and useful system wiring apparatus and related techniques that address the need to feed power and electronic signals to and from a sample board between the cold, low pressure region in a vacuum chamber and outside room temperature and atmospheric pressure. The wiring apparatus balances electrical resistance with the thermal conductivity of the power and signal conductors. Printed flexible cables are used having an annular sealing region which together with O-rings provide vacuum sealing while allowing electrical signals to pass between integrated circuit(s) inside the vacuum chamber and equipment outside the chamber. A thermal anchor is placed along the printed flexible cable to maintain a desired temperature along the cable. The printed flexible circuits are multilayer with two outer layers serving as an RF shield while two inner layers comprise the signal lines which typically require shielding, electrical isolation from each other and from external electromagnetic fields.

公开(公告)号：US20240008168A1

公开(公告)日：2024-01-04

申请号：US18225273

申请日：2023-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHIO

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0242 ,  H05K1/028 ,  H01P3/081 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/0129 ,  H05K2201/09681

Abstract: When viewed in an up-down direction, a first line-shaped reference conductor layer extends along a first signal conductor layer such that portions thereof overlap. When viewed in the up-down direction, the first line-shaped reference conductor layer meanders such that one or more first projecting portions projecting from the first signal conductor layer in a first orthogonal direction and one or more second projecting portions projecting from the first signal conductor layer in a second orthogonal direction alternate in a transmission direction. A section of at least one or more first pairs of projecting portions excluding both ends thereof is not connected to a conductor layer other than one or more of the one or more first projecting portions and one or more of the one or more second projecting portions included in the at least one or more first pairs of projecting portions.

公开(公告)号：US20190014659A1

公开(公告)日：2019-01-10

申请号：US16131448

申请日：2018-09-14

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Matthew H. Frey ,  Stephen P. Maki

IPC: H05K1/02 ,  G02B1/116 ,  G02B27/14 ,  G06F3/041 ,  H05K1/03 ,  H05K1/09 ,  H05K3/06 ,  H05K3/46 ,  H05K9/00

CPC classification number: H05K1/0274 ,  B82Y20/00 ,  B82Y30/00 ,  B82Y99/00 ,  G02B1/116 ,  G02B27/142 ,  G06F3/041 ,  H03K17/962 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/061 ,  H05K3/4644 ,  H05K9/0086 ,  H05K9/0096 ,  H05K2201/0108 ,  H05K2201/09681 ,  Y10S977/755

Abstract: The present disclosure provides an article having a conductor micropattern disposed on a major surface of a substrate. The conductor micropattern includes a plurality of curved traces defining a plurality of cells not lying on a repeating array. The conductor micropattern may have a uniform distribution of trace orientation. The conductor micropattern may be a tri-layer material including in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

公开(公告)号：US10061447B2

公开(公告)日：2018-08-28

申请号：US14806557

申请日：2015-07-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jiuzhi Xue

IPC: G06F3/041 ,  H05K1/09 ,  H05K1/02 ,  G06F3/044 ,  H05K3/12

CPC classification number: G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K3/1241 ,  H05K3/125 ,  H05K2201/0108 ,  H05K2201/09681 ,  H05K2203/0126 ,  H05K2203/1131 ,  H05K2203/1476

Abstract: A flexible conductive coating including: a first plurality of conductive traces extending in a first direction and a second plurality of conductive traces, each of the conductive traces including metal nanoparticles and ones of the second plurality of conductive traces being electrically coupled to ones of the first plurality of conductive traces, wherein each of the first plurality of conductive traces includes two substantially parallel long sides and two rounded short sides connecting the two long sides, and wherein more of the metal nanoparticles are at an outer edge of each of the conductive traces than are at an inner region bounded by the sides of each of the conductive traces.

公开(公告)号：US09991196B2

公开(公告)日：2018-06-05

申请号：US15435398

申请日：2017-02-17

Applicant: Silicon Motion, Inc.

Inventor： Shu-Ying Huang ,  Te-Wei Chen ,  Hsiu-Yuan Chen

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H05K3/00 ,  H05K3/24

CPC classification number: H01L23/49838 ,  H01L21/4846 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49805 ,  H01L24/97 ,  H05K3/0097 ,  H05K3/242 ,  H05K2201/09681 ,  H05K2203/072 ,  H05K2203/0723

Abstract: The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one package unit of the printed circuit board. The package unit includes at least one ground line, at least one power line and a plurality of signal lines. The ground line has a first contact pad exposed on a surface of the printed circuit board, and at least one of the ground lines is connected to the plating bar. The power line has a second contact pad exposed on the surface, and at least one of the power lines is connected to the neighboring plating bar. The signal line has a third contact pad exposed on the surface.

公开(公告)号：US09961765B2

公开(公告)日：2018-05-01

申请号：US15271800

申请日：2016-09-21

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Brian M. Erwin

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K1/03 ,  H05K3/28 ,  B05D3/10 ,  B41N1/08 ,  C23C22/76 ,  C23C22/66 ,  C23C22/78

CPC classification number: H05K1/0275 ,  B05D3/102 ,  B41N1/083 ,  C23C22/66 ,  C23C22/76 ,  C23C22/78 ,  C25D11/04 ,  C25D11/045 ,  C25D11/16 ,  H01L23/57 ,  H05K1/00 ,  H05K1/0306 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/115 ,  H05K1/16 ,  H05K3/06 ,  H05K3/28 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/07 ,  H05K2201/09681 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/033 ,  H05K2203/0369 ,  H05K2203/0392 ,  H05K2203/0733 ,  H05K2203/1142

Abstract: A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

公开(公告)号：US20180110120A1

公开(公告)日：2018-04-19

申请号：US15845342

申请日：2017-12-18

Applicant: FUJIFILM Corporation

Inventor： Hiroshige NAKAMURA ,  Tadashi KURIKI

IPC: H05K1/02 ,  G06F3/044

CPC classification number: H05K1/0296 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K2201/09681

Abstract: A conductive component includes: a first electrode pattern which is made of metal thin wires, the first electrode pattern including a plurality of first conductive patterns that extend in a first direction. Each first conductive pattern includes, at least, inside thereof, a sub-nonconduction pattern that is electrically separated from the first conductive pattern. An area A of each first conductive pattern and an area B of each sub-nonconduction patterns satisfy a relation of 5%

公开(公告)号：US09859264B2

公开(公告)日：2018-01-02

申请号：US15378947

申请日：2016-12-14

Applicant: Toshiba Memory Corporation

Inventor： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC: G11C5/06 ,  H01L25/18 ,  H01L23/498 ,  H01L27/115 ,  H01L25/00 ,  H01L23/528 ,  H05K1/02 ,  H05K3/30

CPC classification number: H01L25/18 ,  G11C5/02 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/115 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/613 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

公开(公告)号：US09812228B2

公开(公告)日：2017-11-07

申请号：US15367642

申请日：2016-12-02

Applicant: Lockheed Martin Corporation

Inventor： Stephen Gonya ,  Jesse Iannon

IPC: H01L23/00 ,  G21F3/00 ,  H05K1/02 ,  H01L23/552

CPC classification number: G21F3/00 ,  H01L23/552 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/0209 ,  H05K1/0275 ,  H05K2201/0715 ,  H05K2201/09681 ,  H01L2924/00

Abstract: An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings of the wire mesh and in contact with metallic portions thereof. The XRO film can be capable of absorbing at least a portion of X-ray energy thereby creating an interference pattern when the XRO film is coupled with an electronic circuit and placed between an X-ray source and an X-ray detector and subjected to radiographic inspection. The interference pattern can create sufficient visual static to effectively obscure circuit lines in the electronic circuit when subjected to radiographic inspection techniques. The XRO film can be substantially thinner than existing solutions for preventing X-ray inspection with an exemplary embodiment being no more than 5 mils thick. The metallic XRO film can also provide electromagnetic shielding and/or heat dissipation for electronic circuits.

公开(公告)号：US20170277290A1

公开(公告)日：2017-09-28

申请号：US15508853

申请日：2016-01-29

Applicant: FUJIKURA LTD.

Inventor： Makoto Murakami

IPC: G06F3/041 ,  H05K1/02 ,  H05K3/20

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/20 ,  H05K3/207 ,  H05K3/38 ,  H05K2201/09045 ,  H05K2201/09681 ,  H05K2203/0502

Abstract: A wiring body includes a conductive portion that includes a contact surface having a concave-convex shape, and an adhesive layer stacked on the contact surface. The conductive portion further includes a top surface facing the contact surface that contains conductive particles. The adhesive layer includes a smooth portion with a smooth main surface provided at a constant thickness, and a protrusion that protrudes from the main surface toward a side of the conductive portion provided on the smooth portion to correspond to the conductive portion. The protrusion comes into contact with the contact surface and includes a concave-convex surface complementary to the concave-convex shape of the contact surface. The contact surface is positioned on a side of the top surface with respect to the main surface and a unit length of the contact surface is larger than a unit length of the top surface.